Semiconductor device and method of fabricating the same

ABSTRACT

There is disclosed a semiconductor device and a method of fabricating the semiconductor device in which a heat treatment time required for crystal growth is shortened and a process is simplified. Two catalytic element introduction regions are arranged at both sides of one active layer and crystallization is made. A boundary portion where crystal growth from one catalytic element introduction region meets crystal growth from the other catalytic element introduction region is formed in a region which becomes a source region or drain region.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device including acircuit constituted by thin film transistors (hereinafter referred to asTFTs) and a method of fabricating the same. For example, the inventionrelates to an electro-optical device typified by a liquid crystaldisplay panel, and an electronic apparatus incorporating such anelectro-optical device as a component.

Note that in the present specification, the term “semiconductor device”indicates any devices capable of functioning by using semiconductorcharacteristics, and all of the electro-optical devices, semiconductorcircuits, and electronic apparatuses are semiconductor devices.

2. Description of the Related Art

In recent years, attention has been paid to a technique to construct athin film transistor (TFT) by using a semiconductor thin film (thicknessof several to several hundreds nm) formed over a substrate having aninsulating surface. The thin film transistor is widely used for anelectronic device such as an IC or electro-optical device, and itsdevelopment is hastened especially as a switching element of an imagedisplay device.

As a semiconductor thin film forming an active layer of a TFT, althougha noncrystalline silicon film (typically an amorphous silicon film) hasbeen often used, a demand for a TFT having a faster operation speed isincreased, and a crystalline silicon film (typically a polysilicon film)has become the mainstream. As a technique for obtaining the crystallinesilicon film, a method in which after an amorphous silicon film isformed, the film is crystallized by a heat treatment or irradiation oflaser light, is often used.

Besides, there is disclosed a technique (Japanese Patent UnexaminedPublication No. Hei. 6-232059 and No. Hei. 7-321339) in which after anamorphous silicon film is formed, a catalytic element (for example,nickel) for promoting crystallization of the amorphous silicon film isintroduced, and a heat treatment is carried out to obtain a crystallinesilicon film. According to this technique, it is possible to obtain auniform crystalline silicon film in a short time.

However, the catalytic element for promoting crystallization of theamorphous silicon film often deteriorates the characteristics of theTFT. Then, after crystallization, a region where the catalytic elementexists at a high concentration is removed by etching or the like.

Hereinafter, a specific description will be made on a crystallizingtechnique using a catalytic element for promoting crystallization of anamorphous silicon film, and a technique for removing a region where thecatalytic element exists at a high concentration.

In FIGS. 1A and 1B, reference numeral 101 designates a silicon film;102, a beltlike region on a silicon film surface (hereinafter referredto as a catalytic element introduction region); and 103, a silicon oxidemask covering the silicon film surface other than the catalytic elementintroduction region. Note that by using the silicon oxide mask 103, thecatalytic element is selectively introduced into the catalytic elementintroduction region 102.

First, the catalytic element is introduced into the catalytic elementintroduction region 102, and by carrying out a heat treatment, crystalsare made to grow from the catalytic element introduction region 102 in adirection parallel to an insulating surface and a direction almostvertical to a long side of the catalytic element introduction region102. Note that reference numeral 104 designates the direction of crystalgrowth.

A leading end portion of crystal growth obtained in this way isdesignated by 105. It is known that the catalytic element of highconcentration exists in the leading end portion 105 of the crystalgrowth. When a crystal growth distance exceeds some value, a regionwhere an active layer of a TFT can be disposed is formed between thebeltlike catalytic element introduction region 102 and the leading endportion 105 of the crystal growth where the catalytic element exists ata high concentration.

Next, when the active layer of the TFT is formed using the regionsandwiched between the leading end portion 105 of the crystal growth andthe beltlike catalytic element introduction region 102, other regions(including at least the leading end portion 105 of crystal growth) wherethe catalytic element exists at a high concentration are removed byetching.

Conventionally, the arrangement of the catalytic element introductionregion is determined so that a region which becomes an active layer of aTFT in a subsequent step exists in the region sandwiched between theleading end portion 105 of the crystal growth and the beltlike catalyticelement introduction region 102, and a heat treatment condition forcrystallization is determined.

Conventionally, it has been considered to be appropriate that thearrangement of the catalytic element introduction region is determinedso that the region which becomes the active layer of the TFT in thesubsequent step exists in the region sandwiched between the leading endportion of the crystal growth and the catalytic element introductionregion. Besides, even if the catalytic element is removed in a stepsubsequent to crystallization, since it is difficult to completelyremove the catalytic element, it has been considered to be sufficient ifa necessary minimum amount of catalytic element is introduced.

Thus, one catalytic element introduction region has been provided at oneside of the region which becomes the active layer of the TFT in thesubsequent step. Note that a crystal growth velocity at 570° C. in thecase where only one catalytic element introduction region (width w=10μm) was disposed was about 3 μm/hr.

SUMMARY OF THE INVENTION

The present inventors paid attention to the fact that crystal growthconditions greatly depend on the width of a catalytic elementintroduction region and an arrangement interval, and found a method foreffectively performing crystal growth as compared with a conventionaltechnique.

An object of the present invention is to provide a semiconductor deviceand a method of fabricating the same in which a heat treatment timerequired for crystal growth is shortened as compared with a conventionaltechnique and a process is simplified.

Another object of the present invention is to provide a semiconductordevice and a method of fabricating the same in which catalytic elementintroduction regions are effectively arranged in a small space, to meetrequirements in recent years that a circuit is made minute and isintegrated.

A structure of the present invention disclosed in the presentspecification relates to a semiconductor device comprising a TFTprovided on a substrate having an insulating surface, characterized inthat an active layer of the TFT is made of a crystalline semiconductorfilm formed through crystal growth from a plurality of regions where acatalytic element for promoting crystallization is introduced, theactive layer of the TFT includes a channel forming region, a sourceregion, and a drain region, and the source region or drain regionincludes a boundary portion of regions formed through crystal growthfrom the plurality of regions.

That is, in the present invention, it is characterized in that at leastone of active layer of the TFT includes a first region that has beencrystal grown from one region where a catalytic element is introducedand a second region that has been crystal grown from another regionwhere a catalytic element is introduced.

Further, another structure of the present invention relates to asemiconductor device comprising a TFT provided on a substrate having aninsulating surface, characterized in that an active layer of the TFT ismade of a crystalline semiconductor film formed through crystal growthfrom a plurality of regions where a catalytic element for promotingcrystallization is introduced, the active layer of the TFT includes aplurality of channel forming regions, and a region sandwiched betweenthe plurality of channel forming regions includes a boundary portion ofregions formed through crystal growth from the plurality of regions.

Still further, another structure of the present invention relates to asemiconductor device comprising a CMOS circuit constituted by ann-channel TFT and a p-channel TFT on a substrate having an insulatingsurface, characterized in that an active layer of each of the n-channelTFT and the p-channel TFT is made of a crystalline semiconductor filmformed through crystal growth from a plurality of regions where acatalytic element for promoting crystallization is introduced, theactive layer of each of the n-channel TFT and the p-channel TFT includesa channel forming region, a source region, and a drain region, and thesource region or drain region of the n-channel TFT includes a boundaryportion of regions formed through crystal growth from the plurality ofregions.

Yet further, another structure of the present invention relates to asemiconductor device comprising a CMOS circuit constituted by ann-channel TFT and a p-channel TFT on a substrate having an insulatingsurface, characterized in that an active layer of each of the n-channelTFT and the p-channel TFT is made of a crystalline semiconductor filmformed through crystal growth from a plurality of regions where acatalytic element for promoting crystallization is introduced, theactive layer of each of the n-channel TFT and the p-channel TFT includesa channel forming region, a source region, and a drain region, and thesource region or drain region of the p-channel TFT includes a boundaryportion of regions formed through crystal growth from the plurality ofregions.

In the above-mentioned respective structures, it is characterized inthat the boundary portion is formed in a region where a region formedthrough crystal growth from a first region where the catalytic elementis introduced collide with a region formed through crystal growth from asecond region where the catalytic element is introduced.

Further, in the above-mentioned respective structures, it ischaracterized in that the boundary portion has a linear shape.

In addition, a structure of the present invention realizing theabove-mentioned structure relates to a method of fabricating asemiconductor device, comprising the steps of: forming an amorphoussemiconductor film; introducing a catalytic element for promotingcrystallization in the amorphous semiconductor film selectively; forminga boundary portion by a heat treatment to cause crystal growth from aplurality of regions where the catalytic element is introduced; removingor reducing the catalytic element existing in a region formed throughcrystal growth; and forming an active layer of a TFT by using the regionwhere the catalytic element is removed or reduced.

Further in the above-mentioned structure, it is characterized in thatthe step of selectively introducing the catalytic element is carried outby using a mask having an opening portion for exposing a part of theamorphous semiconductor film, and the mask includes a plurality ofopening portions at both sides of the boundary portion.

Still further, in the above-mentioned respective structure, it ischaracterized in that a source region or drain region of the TFTincluding the boundary portion is formed.

Yet further, in the above-mentioned respective structure, it ischaracterized in that a channel forming region of the TFT is formedbetween the opening portion and the boundary portion.

Furthermore, in the above-mentioned respective structure, it ischaracterized in that the catalytic element for promotingcrystallization is one kind or plural kinds of elements selected fromthe group consisting of Ni, Fe, Co, Cu, Ge, and Pd.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are views showing crystal growth from a catalyticelement introduction region.

FIGS. 2A and 2B are views showing an example of the arrangement ofcatalytic element introduction regions.

FIG. 3 is a view showing the relation between an interval distance d anda crystal growth velocity v.

FIG. 4A is a view of a microscope observation photograph showing aboundary portion and FIG. 4B is its schematic view.

FIG. 5 is a view showing an example of the arrangement of catalyticelement introduction regions and the arrangement of active layerregions.

FIGS. 6A to 6C are views showing an example of an inverter circuit.

FIGS. 7A to 7D are views showing an example of a CMOS circuit.

FIGS. 8A to 8E are views showing fabrication steps.

FIGS. 9A to 9E are views showing fabrication steps.

FIGS. 10A to 10D are views showing fabrication steps.

FIGS. 11A and 11B are views showing fabrication steps.

FIG. 12 is a view showing a sectional structure of a liquid crystaldisplay device.

FIG. 13 is a view showing an outer appearance of an AM-LCD.

FIG. 14 is a view showing a peripheral circuit.

FIGS. 15A to 15C are views showing fabrication steps.

FIG. 16 is a view showing a structure of an active matrix type ELdisplay device.

FIG. 17 is a view showing characteristics of optical transmissivity ofthresholdless antiferroelectric mixed liquid crystal to applied voltage.

FIGS. 18A to 18F are views showing examples of electronic apparatuses.

FIGS. 19A to 19D are views showing examples of electronic apparatuses.

FIGS. 20A to 20C are views showing examples of electronic apparatuses.

FIG. 21 is a view showing the relation between an interval distance dand a crystal growth velocity v.

FIG. 22 is a view showing the relation between an interval distance dand a gettering requirement time.

FIGS. 23A and 23B are a top view and a sectional view of an EL displaydevice.

FIG. 24 is a sectional view of an EL display device.

FIGS. 25A and 25B are a top view and a circuit view of an EL displaydevice.

FIG. 26 is a sectional view of an EL display device.

FIGS. 27A to 27C are equivalent circuit views of EL display devices.

FIGS. 28A and 28B are equivalent circuit views of EL display devices.

FIGS. 29A and 29B are equivalent circuit views of EL display devices.

DETAILED DESCRIPTION OF THE INVENTION

In the present specification, a technique for effectively carrying outcrystal growth by determining the arrangement of catalytic elementintroduction regions will be described below.

The present inventors have made an experiment in which as shown in FIGS.2A and 2B, crystallization is made while two catalytic elementintroduction regions 201 and 202 are arranged at both sides of oneactive layer 204.

If crystallization is made in the state where the region 204 whichbecomes an active layer of a TFT in a subsequent step is sandwichedbetween the two catalytic element introduction regions 201 and 202,crystals mutually grow from one catalytic element introduction region tothe other catalytic element introduction region. Note that it is assumedthat the catalytic element introduction regions 201 and 202 are arrangedso that the position of a channel forming region 204 a of the TFT existsin a region sandwiched between the catalytic element introduction region201 and a leading end portion 205 of the crystals grown from that.

First, an amorphous silicon film having a thickness of 65 nm and asilicon oxide film having a thickness of 150 nm were laminated. Next, inorder to introduce a catalytic element in the catalytic elementintroduction regions 201 and 202, opening portions reaching theamorphous silicon film were formed in the silicon oxide film. Beltlikeregions on the silicon film surface exposed through the opening portionsbecome the catalytic element introduction regions 201 and 202.

Next, nickel was used as a catalytic element for promoting crystalgrowth, and a nickel acetate ethanol solution including the nickelelement of 10 ppm in terms of weight was used to introduce the nickelelement into the catalytic element introduction regions. Finally, a heattreatment at 570° C. was carried out to make crystal growth.

Thereafter, after a phosphorus element was doped (dose amount was made2×10¹⁵ atoms/cm²), a heat treatment (gettering) at 600° C. for 12 hourswas carried out to reduce the nickel element.

In FIGS. 2A and 2B, a crystal growth velocity in a crystal growthdirection 203 (direction from one catalytic element introduction region201 to the other catalytic element introduction region 202) is denotedby v, and an interval distance between the two catalytic elementintroduction regions 201 and 202 is denoted by d. Besides, the width ofeach of the catalytic element introduction regions 201 and 202 isdenoted by w. Here, a heat treatment for crystallization was carried outfor the case of w=10 μm and the case of w=30 μm.

In the above condition, FIG. 3 and FIG. 21 show graphs in which thecrystal growth velocity v is calculated from the value of the intervaldistance d of the region sandwiched between the two catalytic elementintroduction regions. As is apparent from FIG. 3, the crystal growthvelocity v depends on the interval distance d, and in the range of theinterval distance d<400 μm, as the interval distance d becomes large,the crystal growth velocity v becomes low. However, when the intervaldistance d exceeds 400 μm, there is a tendency for the crystal growthvelocity v to become saturated. The value of the saturated crystalgrowth velocity v is almost equal to a crystal growth velocity when onlyone catalytic element introduction region is arranged andcrystallization is made.

In this way, the present inventors found that the crystal growthcondition greatly depends on the interval distance d between the twocatalytic element introduction regions. Besides, the crystal growthvelocity in the direction from the catalytic element introduction region202 to the catalytic element introduction region 201 also depends on theinterval distance d.

Thus, if two catalytic element introduction regions are arranged at bothsides of a desired region, and its interval distance d is made small,crystallization of the desired region can be made effectively and in ashort time. However, in the case where the widths of the two catalyticelement introduction regions are equal to each other, the intervaldistance d is equal to about twice the crystal growth distance. Inaddition, the interval distance d satisfies the following inequality:d<2×((interval between the catalytic element introduction region 201 andthe region 204 which becomes the active layer)+(width of the region 204which becomes the active layer in the crystal growth direction 203)).

As the width w of the catalytic element introduction region becomeswide, the crystal growth velocity v becomes high. Thus, if the width wof the catalytic element introduction region is made wide,crystallization can be made effectively and in a short time.

Note that even if parameters such as heat treatment conditions werechanged, the relation established between the crystal growth velocity vand the interval distance d was not changed.

Like this, in the case where two catalytic element introduction regions(having the same width w) are arranged at both sides of a desired regionand crystal growth is made, crystal growths meet each other at theintermediate position of the two catalytic element introduction regions.This state can be observed by a microscope, and a region where a crystalgrain boundary by the crystal growth from one side is not coincidentwith a crystal grain boundary from the other side extends linearly.Immediately after the crystal growth, since the catalytic element issegregated at the region where the crystal growths meet each other, ifetching is carried out, the segregated portion (region where the crystalgrowths meet each other) can be observed in more detail. FIG. 4A shows aphotograph of the microscope observation and FIG. 4B is a schematic viewthereof. Although the region where the crystal growths meet each othercan be said as one of crystal grain boundaries, unlike crystal grainboundaries 403 a and 403 b seen in FIG. 4B, a linear pattern having alength of several μm or more can be clearly seen. In order todistinguish it from a general crystal grain boundary, in the presentspecification, the region where crystal growths meet each other will bereferred to as a boundary portion 405.

Two catalytic element introduction regions 401 and 402 were arranged sothat the boundary portion 405 formed a part of a source region or drainregion of a TFT, and after crystallization was made in a short time, agettering step of reducing a catalytic element was carried out tofabricate the TFT, and an experiment to compare its characteristics wascarried out. As a result, it was found that TFT characteristics were notparticularly changed.

On the other hand, in the case where the boundary portion 405 isarranged in a channel forming region of the TFT, there occur suchharmful effects that TFT characteristics are deteriorated, and athreshold becomes high.

In the case where the two catalytic element introduction regions 401 and402 are arranged so that the boundary portion 405 forms a part of thesource region or drain region of the TFT, the active layer forming theTFT is made of a crystal region including the crystal grain boundary 403b caused by crystal growth from the region 401, and a crystal regionincluding the crystal grain boundary 403 a caused by crystal growth fromthe region 402. In this case, as compared with the case of forming anactive layer made of only a crystal region grown from one catalyticelement introduction region, a time required for crystallization can beshortened. Like this, it is very important to shorten a time requiredfor crystal growth in view of simplifying a process.

In the present invention, when the arrangement was made so that a marginto some extent was formed between the boundary portion 405 and thechannel forming region of the TFT, it was possible to shorten a timerequired for crystallization without changing the TFT characteristics.However, in view of the fact that the boundary portion 405 hasfluctuation of about 1 μm in deviation a from the center portion, it isdesirable that the margin is made 2 μm or more.

Conventionally, since a heat treatment exceeding 10 hours is carriedout, if the temperature is made higher than 570° C. a nucleus (naturalnucleus) independent on the catalytic element comes to be easilyproduced, and the TFT characteristics are deteriorated. However, if thestructure of the invention is adopted, since crystallization is made ina shorter time, even if the temperature is raised (about 1 to 10° C.),production of the natural nucleus is hard to cause, and an excellentcrystalline semiconductor film with less fluctuation can be obtained.

That is, the present invention is characterized in that the boundaryportion formed by crystal growth from the two catalytic elementintroduction regions is positioned in a region other than a channelforming region of a TFT, preferably in a source region or drain region.

Besides, in the case where after the crystallization is carried out, anelement having a gettering function, typically phosphorus is added inthe two catalytic element introduction regions arranged at both sides ofthe desired region at the small interval distance d, and heating is madeto reduce the catalytic element, it is possible to carry out getteringof the desired region effectively and in a short time.

FIG. 22 is a graph showing the relation between the interval distance dof a region sandwiched between two catalytic element introduction regionand the heat treatment time (heating temperature of 575° C.) requiredfor gettering.

Like this, it is very important to shorten the time required forgettering in view of simplifying the process.

Hereinafter, a mode of carrying the invention will be described.

Consideration will be given to the case where an amorphous silicon filmis crystallized by using, for example, the same condition (the thicknessof the amorphous silicon film is 65 nm, the initial thickness of asilicon oxide film used for a mask for catalytic element introduction is150 nm, and a nickel acetate ethanol solution including a nickel elementof 10 ppm in terms of weight is added to form a catalytic elementintroduction region) as the above condition where the relation of FIG. 3is obtained.

FIG. 5 is a view showing a state immediately after crystallizationcaused by carrying out a heat treatment at 570° C. after an amorphoussilicon film is formed, and catalytic element introduction regions 505and 506 are formed by using a mask made of a silicon oxide film.

As shown in FIG. 5, regions 501, 502, and 503 which become active layersare arranged. The size of the region 501 which becomes the active layeris made a long side of 65 μm and a short side of 45 μm, and the size ofeach of the regions 502 and 503 which become the active layers is made along side of 30 μm and a short side of 28 μm.

Note that a margin between the regions 502 and 503 which become theactive layers is made 2 μm, and the catalytic element introductionregion 505 with a width w=10 μm is arranged. The interval distance dfrom the catalytic element introduction region 505 is made 80 μm and itis arranged in parallel with the catalytic element introduction region506.

In the case where a heat treatment at 570° C. is carried out, as shownin FIG. 5, the crystal growth from one catalytic element introductionregion 505 meets the crystal growth from the other catalytic elementintroduction region 506 at the center portion, and a boundary portion507 is formed. When the margin of 2 μm is considered in view offluctuation of the position where the boundary portion 507 is formed, acrystal growth distance from one catalytic element introduction regionis 42 μm (80 μm÷2+2 μm).

Besides, a crystal growth velocity v from the catalytic elementintroduction region having the width w=10 μm at 570° C. is 6.4 μm/hr.Thus, a heat treatment time needed to obtain a crystalline silicon filmbecomes 6.6 hours.

Note that a region where the region 501 which becomes the active layeroverlaps with the boundary portion 507 becomes a drain region. It isimportant that channel forming regions 501 a and 501 b do not overlapwith the boundary portion 507.

Each of the regions 502 and 503 which become the active layers does notoverlap with the boundary portion 507.

Further, if the heat treatment temperature is raised, it becomespossible to further shorten the heat treatment time. For example, whenthe heat treatment temperature is made 580° C. instead of 570° C., sincethe crystal growth velocity v is 9.5 μm/hr, it becomes possible to makecrystallization in 4.4 hours.

If the width w of the catalytic element introduction region is madelarge, it becomes possible to make crystallization in a shorter time.

After crystallization is carried out in a short time, a gettering stepof reducing the catalytic element is carried out, so that crystallinesilicon having excellent crystallinity is obtained. A TFT is formed byusing a crystalline silicon film obtained in this way and a circuit asshown in FIGS. 6A to 6C or FIGS. 7A to 7C may be formed. Note that inFIG. 6A, the same characters as those of FIG. 5 are used. Although thecatalytic element introduction regions 505 and 506 are shown by dottedlines in FIG. 6A, actually, slight traces merely remain.

FIG. 6B is an A-A′ sectional view. In FIG. 6B, active layers 601 a to601 c are regions where crystal growth was made from the catalyticelement introduction region 506, and active layers 601 d to 601 f areregions where crystal growth was made from the catalytic elementintroduction region 505. Besides, the drawing shows a region (boundaryportion) 507 a where the crystal growth from the catalytic elementintroduction region 506 meets the crystal growth from the catalyticelement introduction region 505.

Note that the circuit shown in FIGS. 6A and 6B is an inverter circuit,and its equivalent circuit is shown in FIG. 6C.

FIG. 7A shows an example of a CMOS circuit. FIG. 7B shows an A-A′sectional view. The drawings show an example in which two catalyticelement introduction regions (not shown) are arranged so that a region701 where crystal growths meet each other exists in a drain region of ap-channel TFT. The two catalytic element introduction regions may bearranged so that distances to the region 701 become equal to each other,or it is also possible to design in such a manner that the widths of thecatalytic element introduction regions are made different from eachother and the region 701 exists in the drain region of the p-channelTFT. In the case where the widths are made different, the position ofthe region 701 is shifted from the center portion of the interval of thecatalytic element introduction regions.

FIG. 7C shows an example in which two catalytic element introductionregions (not shown) are arranged so that a region 702 where crystalgrowths meet each other exists in a drain region of an n-channel TFT.

Like this, the freedom of arrangement of two catalytic elementintroduction regions is high, and it is possible to shorten a timerequired for crystallization by using this.

The present invention having the foregoing structure will be describedin more detail with reference to embodiments shown below.

Embodiment 1

In this embodiment, with respect to the structure of the invention, amethod of fabricating an active matrix type substrate in which a pixelportion and a CMOS circuit as a base of a driver circuit provided at aperiphery thereof are formed at the same time, will be described withreference to FIGS. 8A to 14.

In FIG. 8A, it is desirable to use a glass substrate, a quartzsubstrate, or a silicon substrate as a substrate 801. In thisembodiment, the quartz substrate was used. Other than those, a metalsubstrate or what is obtained by forming an insulating film on astainless substrate may be used as the substrate. In the case of thisembodiment, since heat resistance capable of withstanding a temperatureof 800° C. or higher is required, as long as a substrate satisfies that,any substrate may be used.

A semiconductor film 802 having a thickness of 20 to 100 nm (preferably40 to 80 nm) and comprising amorphous structure is formed on the surfaceof the substrate 801 on which a TFT is to be formed, by a low pressurethermal CVD method, a plasma CVD method, or a sputtering method. Notethat in this embodiment, although an amorphous silicon film having athickness of 60 nm is formed, since a thermal oxidation step is carriedout later, this thickness does not become the final thickness of a TFT.

The semiconductor film comprising the amorphous structure includes anamorphous semiconductor film, and a microcrystalline semiconductor film,and further, a compound semiconductor film comprising amorphousstructure, such as an amorphous silicon germanium film. Further, it isalso effective to continuously form an under film and an amorphoussilicon film on the substrate without opening to the air. By doing so,it becomes possible to prevent pollution on the substrate surface frominfluencing the amorphous silicon film, and fluctuation incharacteristics of a TFT fabricated can be reduced.

Next, a mask film 803 made of an insulating film including silicon isformed on the amorphous silicon film 802, and opening portions 804 a and804 b are formed by patterning. A beltlike region on the surface of theamorphous silicon film exposed through the opening portion becomes acatalytic element introduction region for introducing a catalyticelement for promoting crystallization at a subsequent crystallizing step(FIG. 8A).

The position of the catalytic element introduction region becomesimportant in the subsequent crystallizing step. Although not shown inthis embodiment, a margin of 2 μm from a region which became an activelayer was taken and a beltlike first catalytic element introductionregion (width w=10 μm) was arranged. Then, a second catalytic elementintroduction region was arranged at a side of the active layer oppositeto the first catalytic element introduction region. By use of FIGS. 3and 31, an operator may determine an interval distance d between thefirst catalytic element introduction region and the second catalyticelement introduction region and a width w of the catalytic elementintroduction region. In this embodiment, the interval distance was maded=80 μm, and the width was made w=10 μm. However, it is not necessarythat the interval distance d or the width w is made the same for allregions, but the operator may suitably determine the values in view ofcircuit arrangement.

Note that as the insulating film including silicon, a silicon oxidefilm, a silicon nitride film, or a silicon nitride oxide film may beused. The silicon nitride oxide film is an insulating film includingsilicon, nitrogen, and oxygen at a specific ratio, and is an insulatingfilm expressed by SiOxNy. The silicon nitride oxide film can be formedby SiH₄, N₂O, and NH₃ as raw material gases, and it is appropriate thatthe concentration of nitrogen included is made not less than 25 atomic %and less than 50 atomic %.

At the same time as patterning of the mask film 803, a marker pattern asa reference in a subsequent patterning step is formed. Although theamorphous silicon film 802 is slightly etched when the mask film 803 isetched, this difference in level can be used as the marker pattern laterat the time of adjusting a mask.

Next, a semiconductor film comprising crystal structure is formed inaccordance with a technique disclosed in Japanese Patent UnexaminedPublication No. Hei. 10-247735 (corresponding to U.S. patent applicationSer. No. 09/034,041). The technique disclosed in the publication iscrystallizing means using a catalytic element (one kind or plural kindsof elements selected from nickel, cobalt, germanium, tin, lead,palladium, iron, and copper) for promoting crystallization at the timeof crystallization of a semiconductor film comprising amorphousstructure.

Specifically, a heat treatment is carried out in a state where acatalytic element is held on the surface of a semiconductor filmcomprising amorphous structure, so that the semiconductor filmcomprising the amorphous structure is changed into a semiconductor filmcomprising crystalline structure. Note that as crystallization means, atechnique disclosed in embodiment 1 of Japanese Patent UnexaminedPublication No. Hei. 7-130652 may be used. Although the semiconductorfilm comprising the crystalline structure includes both a so-calledsingle crystal semiconductor film and a polycrystalline semiconductorfilm, the semiconductor film comprising the crystalline structure formedin the publication includes a crystal grain boundary.

Note that in the publication; although a spin coating method is usedwhen a layer including the catalytic element is formed on a mask film, athin film including the catalytic element may be formed by using a vaporphase method such as a sputtering method or vapor deposition method.

Although depending on a hydrogen content, it is desirable that anamorphous silicon film is subjected to a heat treatment at 400 to 550°C. for about 1 hour to sufficiently remove hydrogen, and then,crystallization is made. In that case, it is preferable that thehydrogen content is made 5 atom % or less.

In the crystallizing step, first, a heat treatment at 400 to 500° C. forabout 1 hour is carried out to remove hydrogen from a film, and then, aheat treatment at 500 to 650° C. (preferably 550 to 600° C.) for 3 to 16hours (preferably 5 to 14 hours) is carried out.

In this embodiment; nickel was used as a catalytic element, and thewidths and positions of the catalytic element introduction regions weredevised as described above, so that it was possible to makecrystallization by a heat treatment at 570° C. for 6.6 hours. As aresult, crystallization proceeded in the direction (direction shown byan arrow) parallel with the substrate from the opening portions 804 aand 804 b as start points, and semiconductor films (in this embodiment,crystalline silicon films) 805 a to 805 d comprising crystal structure,in which macroscopic crystal growth directions were regular, were formed(FIG. 8B). Note that a boundary portion of the films 805 b and 805 c isa region where crystal growths meet each other, and nickel exists at arelatively high concentration. Besides, the catalytic elementintroduction regions are arranged so that crystal growths meet eachother also in the films 805 d and 805 a.

Next, a gettering step for removing nickel used in the crystallizingstep from the crystalline silicon film is carried out. In thisembodiment, the previously formed mask film 803 is used as a mask as itis, and a step of adding an element (in this embodiment, phosphorus) ingroup 15 is carried out, so that phosphorus added regions (hereinafterreferred to as gettering regions) 806 a and 806 b including phosphorusat a concentration of 1×10¹⁹ to 1×10²⁰ atoms/cm³ are formed in thecrystalline silicon film exposed through the opening portions 804 a and804 b (FIG. 8C).

Next, a heat treatment step at 450 to 650° C. (preferably 500 to 550°C.) for 4 to 24 hours, preferably 6 to 12 hours, is carried out in anitrogen atmosphere. By this heat treatment, nickel in the crystallinesilicon film is moved in the direction of an arrow, and is captured inthe gettering regions 806 a and 806 b by the gettering function ofphosphorus. That is, since nickel is removed from the crystallinesilicon film, the concentration of nickel included in crystallinesilicon films 807 a to 807 d after gettering can be reduced to 1×10¹⁷atms/cm³ or less, preferably 1×10¹⁶ atms/cm³.

Next, the mask film 803 is removed, and a protective film 808 for thetime of subsequent impurity addition is formed on the crystallinesilicon films 807 a to 807 d. As the protective film 808, it isappropriate that a silicon nitride oxide film or silicon oxide filmhaving a thickness of 100 to 200 nm (preferably 130 to 170 nm) is used.This protective film 808 has meanings to prevent the crystalline siliconfilms from being directly exposed to plasma at the time of impurityaddition, and to enable subtle concentration control.

Then, a resist mask 809 is formed thereon, and an impurity element togive a p type (hereinafter referred to as a p-type impurity element) isadded through the protective film 808. As the p-type impurity element,typically an element in group 13, exemplarily boron or gallium can beused. This step (called a channel doping step) is a step for controllinga threshold voltage of a TFT. Here, boron is added by an ion dopingmethod in which diborane (B₂H₆) is plasma excited without performingmass separation. Of course, an ion implantation method in which massseparation is performed may be used.

By this step, impurity regions 810 a and 810 b including the p-typeimpurity element (in this embodiment, boron) at a concentration of1×10¹⁵ to 1×10¹⁸ atoms/cm³ (typically 5×10¹⁶ to 5×10¹⁷ atoms/cm³) areformed. Note that in the present specification, an impurity regionincluding the p-type impurity element in the above concentration range(however, the region does not include phosphorus) is defined as a p-typeimpurity region (b) (FIG. 8D).

Next, the resist mask 809 is removed, and the crystalline silicon filmsare patterned to form island-like semiconductor layers (hereinafterreferred to as active layers) 811 to 814. Although not shown, when thecrystalline silicon films are etched, the substrate or the under filmprovided on the substrate is also slightly etched. Thus, traces ofarrangement of the catalytic element introduction regions slightlyremain.

Note that the active layers 811 to 814 are formed of crystalline siliconfilms having very excellent crystallinity by selectively introducingnickel to make crystallization. Specifically, the respective films havesuch crystal structure that rod-like or column-like crystals arearranged with specified directionality. After crystallization, nickel isremoved or reduced by the gettering function of phosphorus, and theconcentration of the catalytic element remaining in the active layers811 to 814 is 1×10¹⁷ atms/cm³ or less, preferably 1×10¹⁶ atms/cm³ (FIG.8E).

The active layer 811 of a p-channel TFT is a region which does notinclude an intentionally introduced impurity element, and the activelayers 812 to 814 of n-channel TFTs are p-type impurity regions (b). Inthe present specification, it is defined that all of the active layers811 to 814 in this state are intrinsic or substantially intrinsic. Thatis, it may be considered that a region where an impurity element isintentionally introduced to such a degree as not to obstruct theoperation of a TFT, is a substantially intrinsic region.

Next, an insulating film including silicon and having a thickness of 10to 100 nm is formed by a plasma CVD method or sputtering method. In thisembodiment, a silicon nitride oxide film having a thickness of 30 nm isformed. As the insulating film including silicon, another insulatingfilm including silicon may be used as a single layer or a laminatelayer.

Next, a heat treatment step at a temperature of 800 to 1150° C.(preferably 900 to 1000° C.) for 15 minutes to 8 hours (preferably 30minutes to 2 hours) is carried out in an oxidizing atmosphere (thermaloxidation step). In this embodiment, a heat treatment step at 950° C.for 80 minutes is carried out in an atmosphere of an oxygen atmosphereadded with hydrogen chloride of 3 vol %. Note that boron added in thestep of FIG. 8D is activated in this thermal oxidation step (FIG. 9A).

Note that as the oxidizing atmosphere, although both a dry oxygenatmosphere and a wet oxygen atmosphere may be used, the dry oxygenatmosphere is suitable for reducing crystal defects in a semiconductorlayer. Besides, although this embodiment uses the atmosphere in whichthe halogen element is included in the oxygen atmosphere, the heattreatment step may be carried out in a 100% oxygen atmosphere.

During this thermal oxidation step, an oxidizing reaction proceeds alsoat interfaces between the insulating film including silicon and theactive layers 811 to 814 thereunder. In the present invention, in viewof that, adjustment is made so that the thickness of a finally formedgate insulating film 815 becomes 50 to 200 nm (preferably 100 to 150nm). In the thermal oxidation step of this embodiment, a layer of 25 nmin the active layer having a thickness of 60 nm is oxidized so that thethickness of each of the active layers 811 to 814 becomes 35 nm.Besides, since a thermal oxidation film having a thickness of 50 nm isadded to the insulating film having a thickness of 30 nm and includingsilicon, the thickness of the final gate insulating film 815 becomes 105nm.

Next, resist masks 816 to 819 are newly formed. Then, an impurityelement to give an n type (hereinafter referred to as an n-type impurityelement) is added to form impurity regions 820 to 822 exhibiting an ntype. As the n-type impurity element, typically an element in group 15,exemplarily phosphorus or arsenic can be used (FIG. 9B).

The impurity regions 820 to 822 are impurity regions which are made tosubsequently function as LDD regions in n-channel TFTs of a CMOS circuitand a sampling circuit. Note that in the impurity regions formed here,the n-type impurity element is included at a concentration of 2×10¹⁷ to5×10¹⁹ atoms/cm³ (typically 5×10¹⁷ to 5×10¹⁸ Amos/cm³). In the presentspecification, an impurity region including an n-type impurity elementin the above concentration range is defined as an n-type impurity region(b).

Here, phosphorus is added at a concentration of 1×10¹⁸ atoms/cm³ by anion doping method in which phosphine (PH₃) is plasma excited withoutperforming mass separation. Of course, an ion implantation method inwhich mass separation is performed may be used. In this step, phosphorusis added in the crystalline silicon films through the gate film 815.

Next, a heat treatment is carried out in an inert gas atmosphere at 600to 1000° C. (preferably 700 to 800° C.), and phosphorus added in thestep of FIG. 9B is activated. In this embodiment, a heat treatment at800° C. for 1 hour is carried out in a nitrogen atmosphere (FIG. 9C).

At this time, it is possible to repair the active layers damaged at thetime of addition of phosphorus and the interfaces between the activelayers and the gate insulating film at the same time. Although it ispreferable to use furnace annealing using an electric heating furnace inthis activating step, light annealing such as lamp annealing or laserannealing may be used at the same time.

By this step, boundary portions of the n-type impurity regions (b) 820to 822, that is, contact portions to the intrinsic or substantiallyintrinsic regions (of course, including the p-type impurity regions (b)as well) existing around the n-type impurity regions (b) become clear.This means that at the point of time when a TFT is later completed, anLDD region and a channel forming region can form a very excellentcontact portion.

Next, a conductive film which becomes a gate wiring line is formed.Although the gate wiring line may be formed of a conductive film of asingle layer, as needed, it is preferable to form a laminate film suchas a two-layer or three-layer film. In this embodiment, a laminate filmmade of a first conductive film 823 and a second conductive film 824 isformed (FIG. 9D).

Here, as the first conductive film 823 and the second conductive film824, a conductive film including an element selected from tantalum (Ta),titanium (Ti), molybdenum (Mo), tungsten (W), chromium (Cr), and silicon(Si), or including the above element as its main ingredient (typically,a tantalum nitride film, tungsten nitride film, or titanium nitridefilm), or an alloy film made of combination of the foregoing elements(typically a Mo—W alloy film, Mo—Ta alloy film, tungsten suicide film,etc.) may be used.

Note that it is appropriate that the thickness of the first conductivefilm 823 is made 10 to 50 nm (preferably 20 to 30 nm), and the thicknessof the second conductive film 824 is made 200 to 400 nm (preferably 250to 350 nm). In this embodiment, a tungsten nitride (WN) film having athickness of 50 nm is used as the first conductive film 823, and atungsten film having a thickness of 350 nm is used as the secondconductive film 824. Although not shown, it is effective that a siliconfilm having a thickness of about 2 to 20 nm is formed under the firstconductive film 823. By this, adhesiveness of the conductive film formedthereon can be improved, and oxidation can be prevent.

Besides, it is also effective to use a tantalum nitride film as thefirst conductive film 823, and a tantalum film as the second conductivefilm.

Next, the first conductive film 823 and the second conductive film 824are etched together to form gate wiring lines 825 to 828 each having athickness of 400 nm. At this time, the gate wiring lines 826 and 827formed in the driver circuit are formed to overlap with part of then-type impurity regions (b) 820 to 822 through the gate insulating film815. The overlapping portions subsequently become Lov regions. Note thatalthough gate wiring lines 828 a and 828 b are seen to be two in thesection, they are actually formed of one continuously connected pattern(FIG. 9E).

Next, a resist mask 829 is formed, and a p-type impurity element (inthis embodiment, boron) is added to form impurity regions 830 and 831including boron at a high concentration. In this embodiment, boron isadded at a concentration of 3×10²⁰ to 3×10²¹ atoms/cm³ (typically 5×10²⁰to 1×10²¹ atoms/cm³) by an ion doping method using diborane (B₂H₆) (ofcourse, an ion implantation method may be used). In the presentspecification, an impurity region including a p-type impurity element inthe foregoing concentration range is defined as a p-type impurity region(a) (FIG. 10A).

Next, the resist mask 829 is removed, and resist masks 832 to 834 areformed to cover gate wiring lines and regions which becomes p-channelTFTs. Then, an n-type impurity element (in this embodiment, phosphorus)is added to form impurity regions 835 to 841 including phosphorus at ahigh concentration. Also in this step, an ion doping method usingphosphine (PH₃) (of course, an ion implantation method may be used) isused, and the concentration of phosphorus in the regions is made 1×10²⁰to 1×10²² atoms/cm³ (typically, 2×10²⁰ to 5×10²¹ atoms/cm³) (FIG. 10B).

Note that in the present specification, an impurity region including ann-type impurity element in the foregoing concentration range is definedas an n-type impurity region (a). Although phosphorus or boron alreadyadded in the previous step is included in the regions where the impurityregions 835 to 841 are formed, since phosphorus is added at asufficiently high concentration, it is not necessary to consider theinfluence of phosphorus or boron added in the previous step. Thus, it ispermissible to reword the impurity regions 835 to 841 as n-type impurityregions (a).

Next, the resist masks 832 to 834 are removed, and a cap film 842 madeof an insulating film including silicon is formed. It is appropriatethat its thickness is made 25 to 100 nm (preferably 30 to 50 nm). Inthis embodiment, a silicon nitride film having a thickness of 25 nm isused. Although the cap film 842 functions also as a protective film toprevent oxidation of the gate wiring lines in a subsequent activationstep, if the film is made too thick, stress becomes strong anddisadvantage such as film peeling occurs, so that it is preferable thatthe thickness is made 100 nm or less.

Next, an n-type impurity element (in this embodiment, phosphorus) isadded in a self-aligning manner with the gate wiring lines 825 to 828 asmasks. Adjustment is made so that phosphorus is added in impurityregions 843 to 846 thus formed at a concentration of ½ to 1/10(typically ⅓ to ¼) of that of the n-type impurity region (b) (however,the concentration is 5 to 10 times as high as the concentration of boronadded in the foregoing channel doping step, typically 1×10¹⁶ to 5×10¹⁸atoms/cm³, and exemplarily 3×10¹⁷ to 3×10¹⁸ atoms/cm³). Note that in thepresent specification, an impurity region (except for the p-typeimpurity region (a)) including an n-type impurity element in the aboveconcentration range is defined as an n-type impurity region (c) (FIG.10C).

In this step, phosphorus is added through the insulating film (laminatefilm of the cap film 842 and the gate insulating film 815) having athickness of 105 nm, and the cap film formed at side walls of the gatewiring lines 834 a and 834 b also functions as a mask. That is, anoffset region with a length equal to the thickness of the cap film 842is formed. Note that the term “offset region” indicates a highresistance region which is formed to be in contact with a channelforming region and is formed of a semiconductor film having the samecomposition as the channel forming region, but which does not form aninversion layer (channel forming region) since a gate voltage is notapplied. In order to lower an off current value, it is important tosuppress the overlap of an LDD region and a gate wiring line to theutmost, and in that meaning, it can be said that to provide the offsetregion is effective.

Note that as in this embodiment, in the case where the channel formingregion also includes the p-type impurity element at a concentration of1×10¹⁵ to 1×10¹⁸ atoms/cm³, naturally, the offset region also includesthe p-type impurity element at the same concentration.

Although the length of the offset region is determined by the thicknessof the cap film actually formed at the side wall of the gate wiring lineand a going around phenomenon (phenomenon in which an impurity is addedso as to get into a region under a mask) at the time of adding theimpurity element, from the viewpoint of suppressing the overlap of theLDD region and the gate wiring line, it is very effective to form thecap film previously at the time of forming the n-type impurity region(c) as in this embodiment.

Note that in this step, although phosphorus is added at a concentrationof 1×10¹⁶ to 5×10¹⁸ atoms/cm³ in all impurity regions except portionsconcealed with the gate wiring lines, since the concentration is verylow, it does not have an influence on the function of each impurityregion. Although boron has been added at a concentration of 1×10¹⁵ to1×10¹⁸ atoms/cm³ in the n-type impurity regions (b) 843 to 846 in thechannel doping step, since phosphorus is added in this step at aconcentration 5 to 10 times as high as that of boron included in thep-type impurity regions (b), also in this case, it can be said thatboron does not have an influence on the function of the n-type impurityregions (b).

However, strictly speaking, in the n-type impurity regions (b) 847 and848, the concentration of phosphorus in the portion overlapping with thegate wiring line remains 2×10¹⁶ to 5×10¹⁹ atoms/cm³, while in theportion not overlapping with the gate wiring line, phosphorus of aconcentration of 1×10¹⁶ to 5×10¹⁸ atoms/cm³ is added to that, and theportion includes phosphorus at a slightly higher concentration.

Next, a first interlayer insulating film 849 is formed. The firstinterlayer insulating film 849 is formed of an insulating film includingsilicon, specifically a silicon nitride film, a silicon oxide film, asilicon nitride oxide film, or a laminate film of combination of those.It is appropriate that its thickness is made 100 to 400 nm. In thisembodiment, a silicon nitride oxide film (nitrogen concentration is 25to 50 atomic %) having a thickness of 200 nm is formed by a plasma CVDmethod using SiH₄, N₂O, and NH₃ as raw material gases.

Thereafter, a heat treatment step for activating the n-type and p-typeimpurity elements added at each concentration is carried out. This stepcan be carried out by using a furnace annealing method, a laserannealing method, a lamp annealing method or a combination of those. Inthe case where this step is carried out by the furnace annealing method,it is appropriate that the step is carried out in an inert gasatmosphere at 500 to 800° C., preferably 550 to 600° C. In thisembodiment, a heat treatment at 600° C. for 4 hours is carried out, sothat the impurity elements are activated (FIG. 10D).

Note that in this embodiment, the gate wiring lines are covered in thestate where the silicon nitride film 842 and the silicon nitride oxidefilm 849 are laminated, and the activation step is carried out in thatstate. In this embodiment, although tungsten is used as a wiring linematerial, it is known that a tungsten film is very weak to oxidation.That is, even if oxidation is made while the tungsten film is coveredwith a protective film, if a pinhole exists in the protective film, itis immediately oxidized. However, in this embodiment, the siliconnitride film extremely effective as an oxidation resistant film is used,and the silicon nitride oxide film is laminated to the silicon nitridefilm, so that it is possible to carry out the activation step at a hightemperature without paying attention to the problem of the pinhole onthe silicon nitride film.

Next, after the activation step, a heat treatment at 300 to 450° C. for1 to 4 hours is carried out in an atmosphere including hydrogen of 3 to100% to hydrogenate the active layers. This step is a step ofterminating dangling bonds of a semiconductor layer by thermally excitedhydrogen. As other means for hydrogenating, plasma hydrogenating (usinghydrogen excited by plasma) may be carried out.

When the activation step is ended, a second interlayer insulating film850 having a thickness of 500 nm to 1.5 μm is formed on the firstinterlayer insulating film 849. In this embodiment, as the secondinterlayer insulating film 850, a silicon oxide film having a thicknessof 800 nm is formed by a plasma CVD method. In this way, an interlayerinsulating film made of a laminate film of the first interlayerinsulating film (silicon nitride oxide film) 849 and the secondinterlayer insulating film (silicon oxide film) 850 and having athickness of 1 μM is formed.

If there is no problem in view of heat resistance in a subsequent step,as the second interlayer insulating film 850, it is also possible to usean organic resin film of polyimide, acryl, polyamide, polyimidoamid, BCB(benzocyclobutene), or the like.

Thereafter, a contact hole reaching a source region or drain region ofeach TFT is formed, and source wiring lines 851 to 854 and drain wiringlines 855 to 857 are formed. Note that in order to form the CMOScircuit, the drain wiring line 855 is made common between the p-channelTFT and n-channel TFT. Although not shown, in this embodiment, thiswiring line is made a laminate film of three-layer structure in which aTi film having a thickness of 200 nm, an aluminum film including Ti andhaving a thickness of 500 nm, and a Ti film having a thickness of 100 nmare continuously formed by a sputtering method (FIG. 11A).

Next, as a passivation film 858, a silicon nitride film, a silicon oxidefilm, or a silicon nitride oxide film having a thickness of 50 to 500 nm(typically 200 to 300 nm) is formed. At this time, in this embodiment,prior to formation of the film, a plasma treatment is carried out byusing a gas including hydrogen, such as H₂ or NH₃, and a heat treatmentis carried out after film formation. Hydrogen excited by thispre-treatment is supplied to the first and second interlayer insulatingfilms. By carrying out the heat treatment in this state, the filmquality of the passivation film 858 is improved, and since hydrogenadded in the first and second interlayer insulating films is diffused toa lower layer side, the active layers can be effectively hydrogenated.

Besides, after the passivation film 858 is formed, a hydrogenating stepmay be further carried out. For example, it is appropriate that a heattreatment at 300 to 450° C. for 1 to 12 hours is carried out in anatmosphere including hydrogen of 3 to 100%, or even if a plasmahydrogenating method is used, the same effect can be obtained. Note thatat a position where a contact hole for connecting a pixel electrode witha drain wiring line is to be formed after the hydrogenating step, anopening portion (not shown) may be formed in the passivation film 858.

Thereafter, a third interlayer insulating film 859 made of organic resinand having a thickness of about 1 μm is formed. As the organic resin,polyimide, acryl, polyimide, polyimidoamid, BCB (benzocyclobutene) orthe like may be used. As the merits of using the organic resin film, itis possible to enumerate such points that a film formation method issimple, parasitic capacitance can be reduced since a relative dielectricconstant is low, and the film is excellent in flatness. Note that it isalso possible to use a film of organic resin other than the above, anorganic SiO compound, or the like. Here, polyimide of a type in whichthermal polymerization is made after application to the substrate isused, and is fired at 300° C. to form the film.

Next, in a region which becomes a pixel portion, a shielding film 860 isformed on the third interlayer insulating film 859. In the presentspecification, the term “shielding film” is used to mean shielding lightand electromagnetic wave. The shielding film 860 is formed of a filmincluding an element selected from aluminum (Al), titanium (Ti), andtantalum (Ta), or a film including any one element as its mainingredient and having a thickness of 100 to 300 nm. In this embodiment,an aluminum film including titanium of 1 wt % is formed to a thicknessof 125 nm.

Note that when an insulating film, such as a silicon oxide film, havinga thickness of 5 to 50 nm is formed on the third interlayer insulatingfilm 859, the adhesiveness of a shielding film formed thereon can beraised. Besides, when a plasma treatment using a CF₄ gas is performed onthe surface of the third interlayer insulating film 859 made of organicresin, the adhesiveness of a shielding film formed on the film can beimproved by the improvement of surface quality.

Besides, by using the aluminum film including titanium, other connectionwiring lines can also be formed in addition to the shielding film. Forexample, a connection wiring line connecting circuits can be formed inthe driver circuit. However, in that case, before the film is formed ofmaterial for forming the shielding film or the connection wiring line,it is necessary to previously form a contact hole in the thirdinterlayer insulating film.

Next, an oxide 861 having a thickness of 20 to 100 nm (preferably 30 to50 nm) is formed on the surface of the shielding film 860 by an anodicoxidation method or plasma oxidation method (in this embodiment, theanodic oxidation method). In this embodiment, since the film includingaluminum as its main ingredient is used as the shielding film 860, analuminum oxide film (alumina film) is formed as the anodic oxide 861.

At the anodic oxidation treatment, first, a tartaric acid ethyleneglycol solution having a sufficiently small alkaline ion concentrationis prepared. This is a solution of a mixture of 15% of tartaric acidammonium solution and ethylene glycol at a ratio of 2:8, and ammoniawater is added to this, so that pH is adjusted to become 7±0.5. Then, aplatinum electrode which becomes a cathode is provided in this solution,the substrate on which the shielding film 860 is formed is immersed inthe solution, the shielding film 860 is made an anode, and a constant(several mA to several tens mA) dc current is made flow.

Although the voltage between the cathode and the anode in the solutionis changed with a time in accordance with the growth of the anodicoxidation, the voltage is raised at a voltage rising rate of 100 V/minwhile constant current is kept, and when the voltage reaches an attainedvoltage of 45 V, the anodic oxidation treatment is ended. In this way,the anodic oxide 861 having a thickness of about 50 nm can be formed onthe surface of the shielding film 860. As a result, the thickness of theshielding film 860 becomes 90 nm. Note that the numerical valuesrelative to the anodic oxidation shown here are merely examples, andoptimum values are naturally changed according to the size of afabricated device or the like.

Besides, here, although such a structure is adopted that the insulatingfilm is provided only on the surface of the shielding film by using theanodic oxidation method, the insulating film may be formed by a vaporphase method such as a plasma CVD method, a thermal CVD method, or asputtering method. Also in that case, it is preferable that thethickness is made 20 to 100 nm (preferably 30 to 50 nm). Besides, asilicon oxide film, a silicon nitride film, a silicon nitride oxidefilm, a DLC (Diamond Like Carbon) film, a tantalum oxide film, or anorganic resin film may be used. Further, a laminate film of acombination of these may be used.

Next, a contact hole reaching the drain wiring line 857 is formed in thethird interlayer insulating film 859 and the passivation film 858, and apixel electrode 862 is formed. Note that a pixel electrode 863 is apixel electrode of an adjacent different pixel. As for the pixelelectrodes 862 and 863, it is appropriate that a transparent conductivefilm is used in the case where a transmission type liquid crystaldisplay device is formed, and a metal film is used in the case where areflection type liquid crystal display device is formed. Here, in orderto form the transmission type liquid crystal display device, anindium-tin oxide (ITO) film having a thickness of 110 nm is formed by asputtering method.

At this time, the pixel electrode 862 and the shielding film 860 overlapwith each other through the anodic oxide 861, and holding capacitor(storage capacitor) 864 is formed. In this case, it is desirable thatthe shielding film 860 is set to a floating state (electrically isolatedstate) or a fixed potential, preferably a common potential (intermediatepotential of an image signal transmitted as data).

In this way, the active matrix substrate including the driver circuitand the pixel portion on the same substrate is completed. Note that inFIG. 11B, a p-channel TFT 1101, and n-channel TFTs 1102 and 1103 areformed in the driver circuit, and a pixel TFT, 1104 made of an n-channelTFT is formed in the pixel portion.

In the p-channel TFT 1101 of the driver circuit, a channel formingregion 1001, a source region 1002, and a drain region 1003 arerespectively formed of the p-type impurity region (a). However,strictly, the source region 1002 and the drain region 1003 includephosphorus at a concentration of 1×10¹⁶ to 5×10¹⁸ atoms/cm³.

In the n-channel TFT 1102, a channel forming region 1004, a sourceregion 1005, a drain region 1006, and a region 1007 overlapping with thegate wiring line through the gate insulating film (in the presentspecification, such a region is referred to as a Lov region. The index“ov” is added to mean “overlap”) and positioned between the channelforming region and the drain region are formed. At this time, the Lovregion 1007 includes phosphorus at a concentration of 2×10¹⁶ to 5×10¹⁹atoms/cm³, and is formed so that the whole overlaps with the gate wiringline.

In the n-channel TFT 1103, a channel forming region 1008, a sourceregion 1009, a drain region 1010, and LDD regions 1011 and 1012positioned at both sides of the channel forming region are formed. Thatis, the LDD regions are formed between the source region and the channelforming region, and between the drain region and the channel formingregion.

Note that in this structure, since part of the LDD regions 1011 and 1012overlap with the gate wiring line, a region (Lov region) overlappingwith the gate wiring line through the gate insulating film and a regionnot overlapping with the gate wiring line (in the present specification,such a region is referred to as a Loff region. The index “off” is addedto means “offset”) are realized.

To the channel length of 3 to 7 μm, it is appropriate that the length(width) of the Lov region 1007 of the n-channel TFT 1102 is made 0.3 to3.0 μm, typically 0.5 to 1.5 μm. Besides, it is appropriate that thelength (width) of the Lov region of the n-channel TFT 1103 is made 0.3to 3.0 μm, typically 0.5 to 1.5 μm, and the length (width) of the Loffregion is made 1.0 to 3.5 μm, typically 1.5 to 2.0 μm. Besides, it isappropriate that the length (width) of each of Loff regions 1017 to 1020provided in the n-channel TFT 1104 of the pixel portion is made 0.5 to3.5 μm, typically 2.0 to 2.5 μm.

In this embodiment, since the alumina film having a high dielectricconstant of 7 to 9 is used as a dielectric of the storage capacitor, itis possible to lessen an occupied area of the storage capacitor requiredfor forming necessary capacitance. Further, as in this embodiment, whenthe shielding film formed over the pixel TFT is made one electrode ofthe storage capacitor, the opening rate of an image display portion ofthe active matrix type liquid crystal display device can be improved.

Note that it is not necessary to limit the invention to the structure ofthe storage capacitor shown in this embodiment. For example, it is alsopossible to use a storage capacitor of a structure disclosed in JapanesePatent Application Laid-open No. Hei. 11-133463, No. Hei. 11-97702, orU.S. patent application Ser. No. 09/356,377 by the present assignee.

Next, a step of fabricating a liquid crystal display device from theabove substrate will be described. As shown in FIG. 12, an oriented film1201 is formed to the substrate on which the pixel portion and thedriver circuit in the state of FIG. 11B are formed. In this embodiment,a polyimide film is used as the oriented film. An opposite electrode1203 made of a transparent conductive film and an oriented film 1204 areformed on an opposite substrate 1202. Note that a color filter or ashielding film may be formed on the opposite substrate as needed.

Next, after the oriented film is formed, a rubbing treatment isperformed to make adjustment so that liquid crystal molecules areoriented with a specific pre-tilt angle. Then, the substrate on whichthe pixel portion and the driver circuit are formed is bonded to theopposite substrate by a well-known cell assembling step through a sealmaterial 1206, a spacer (not shown) or the like. The seal material ismade to include resin and fiber. In order to prevent a short circuit, acolumn-like spacer is made not to overlap with an auxiliary capacitanceportion. In the pixel portion, in order to reduce disclination, acolumn-like spacer is provided on the contact of the pixel electrode.Thereafter, a liquid crystal 1205 is injected between both thesubstrates, and both are completely sealed by a sealing agent (notshown). As the liquid crystal, a well known liquid crystal material maybe used. In this way, the liquid crystal display device shown in FIG. 12is completed.

Next, the structure of this liquid crystal display device will bedescribed with reference to FIG. 13. Note that in FIG. 13, commoncharacters are used to make the drawing correspond to the sectionalstructural view of FIG. 12. A pixel portion 1301, a gate side drivercircuit 1302, and a source driver circuit 1303 are formed on a quartzsubstrate 801. A pixel TFT 1104 of a pixel portion is an n-channel TFT,and a driver circuit provided on the periphery is constructed by a CMOScircuit as a base. The gate side driver circuit 1302 and the sourcedriver circuit 1303 are connected to the pixel portion 1301 through agate wiring line 828 and a source wiring line 854, respectively.Besides, there are provided connection wiring lines 1306 and 1307 froman external input/output terminal 1305 to which an FPC 1304 is connectedto input/output terminals of the driver circuits.

Next, an example of the circuit structure of the liquid crystal displaydevice shown in FIG. 13 is shown in FIG. 14. The liquid crystal displaydevice of this embodiment includes a source driver circuit 1401, a gatedriver circuit (A) 1407, a gate driver circuit (B) 1411, a prechargecircuit 1412, and a pixel portion 1406. Note that in the presentspecification, the driver circuit includes the source driver circuit1401 and the gate driver circuit 1407.

The source driver circuit 1401 includes a shift register circuit 1402, alevel shifter circuit 1403, a buffer circuit 1404, and a samplingcircuit 1405. The gate driver circuit (A) 1407 includes a shift registercircuit 1408, a level shifter circuit 1409, and a buffer circuit 1410.The gate driver circuit (B) 1411 also has the same structure.

The structure of this embodiment can be easily realized by fabricatingTFTs in accordance with the steps shown in FIGS. 8A to 11B. Besides, inthis embodiment, although only the structure of the pixel portion andthe driver circuit is shown, when the fabricating steps of thisembodiment are used, it is also possible to form a signal dividingcircuit, frequency dividing circuit, D/A converter circuit, operationalamplifier circuit, γ-correction circuit, and further, signal processingcircuit such as a microprocessor (it may be called a logical circuit) onthe same substrate.

Like this, the present invention can realize a semiconductor deviceincluding a pixel portion and a driver circuit for controlling the pixelportion on the same substrate, for example, a semiconductor deviceincluding a signal processing circuit, a driver circuit, and a pixelportion on the same substrate.

Embodiment 2

In this embodiment, a description will be made on a case where anothermeans is used for reducing the catalytic element in the crystallinesilicon film in the embodiment 1.

In the embodiment 1, although gettering for reducing a catalytic elementin a crystalline silicon film is carried out by performing a heattreatment after a phosphorus element is selectively added, and getteringis carried out by performing a heat treatment in an oxidizing atmosphereincluding a halogen element, this embodiment shows an example in whichafter a gate electrode is formed, a phosphorus element is added, and aheat treatment at 500 to 650° C. for 2 to 16 hours is performed.

First, in accordance with the steps of the embodiment 1, the state ofFIG. 10C was obtained. Next, phosphorus is added into an active layerwith a gate electrode as a mask so that its concentration becomes 5×10¹⁸to 1×10¹⁸ atoms/cm³ (preferably 1×10¹⁹ to 5×10¹⁹ atoms/cm³). However,since the concentration of phosphorus to be added is changed bytemperature and time of a subsequent gettering step, and further by anarea of a phosphorus doped region, the concentration is not limited tothis concentration range. In this way, a region including phosphorus(hereinafter referred to as a phosphorus doped region) was formed (FIG.15A).

Next, a heat treatment at 500 to 650° C. is carried out for 2 to 16hours, so that gettering of a catalytic element (in this embodiment,nickel) used for crystallization of a silicon film is carried out. Inorder to obtain the gettering function, although a temperature of about±50° C. from the highest temperature in a thermal history is required,since the heat treatment for crystallization is carried out at 550 to600° C., the gettering function can be sufficiently obtained by a heattreatment at 500 to 650° C. In this embodiment, a heat treatment at 600°C. for 8 hours was performed so that nickel was moved in the directionof an arrow (shown in FIG. 15B) and was gettered and captured byphosphorus included in the phosphorus doped region. In this way, agettering region (region corresponding to the phosphorus doped region)is formed. By this, the concentration of nickel included in thephosphorus doped region is reduced to 2×10¹⁷ atoms/cm³ or less(preferably, 1×10¹⁶ atoms/cm³ or less).

Next, similarly to the embodiment 1, a first interlayer insulating filmis formed (FIG. 15C).

In accordance with the embodiment 1, the subsequent steps may be carriedout so that a semiconductor device as shown in FIG. 12 is completed.

As another gettering method, a method in which gettering is performed bycontact with a liquid phase using high temperature sulfuric acid may beused.

Note that the structure of this embodiment can be combined with thestructure of the embodiment 1.

Embodiment 3

The crystal structure of an active layer that went through the processesup to the thermal oxidation process shown in FIG. 9A of Embodiment 1 isa unique crystal structure which has continuity in the crystal lattice.Its characteristics are described below.

The crystalline silicon film which was fabricated in accordance with themanufacturing processes of Embodiment 1 has a crystal structure in whicha plurality of needle-like or column-like crystals are gathered andaligned when viewed microscopically. This may readily be confirmedthrough observation using TEM (transmission electron microscopy).

By using electron diffraction and X-ray diffraction, {110} plane wasobserved on its surface (where a channel is to be formed) as a principleorientated film though crystal axis was more or less shifted. As aresult of thoroughly observing an electron diffraction photograph with aspot diameter of approximately 1.5 μm by the Applicant, it was confirmedthat the diffraction spots corresponding to {110} plane appearedregularly, but that each spot is distributed on a concentric circle.

Further, the Applicant observed the crystal grain boundary formed fromcolumn-like crystals that are brought into contact with one another byHR-TEM (high resolution transmissive electron microscopy), it isconfirmed that there is continuity in the crystal lattice in a crystalgrain boundary. This is easily confirmed by the fact that latticestripes observed are continuously connected in the crystal grainboundary.

The continuity of the crystal lattices in the crystal grain boundary isoriginated in that the crystal grain boundary is a grain boundary called‘planar grain boundary’, The definition of the term planar grainboundary in this specification agrees with the ‘planar boundary’described in “Characterization of High-Efficiency Cast-Si Solar CellWafers by MBIC Measurement”, Ryuichi Shimokawa and Yutaka Hayashi,Japanese Journal of Applied Physics, vol. 27, No. 5, pp. 751-758, 1988.

According to the above article, the planar boundary includes a twingrain boundary, a special stacking fault, a special twist grainboundary, etc. The planar boundary is characterized by beingelectrically inert. In other words, it may practically be regarded asnonexisting because it does not function as a trap that inhibitsmovement of carriers in spite of being a crystal grain boundary.

When the crystal axis (axis that is perpendicular to the crystal plane)is <110> axis, in particular, {211} twin grain boundary is also called acorresponding grain boundary of Σ3. The Σ value is a parameter servingas an indicator showing the degree of alignment in a correspondingboundary, and it is known that a grain boundary of smaller Σ value is agrain boundary showing better alignment.

As a result of observing the crystalline silicon film of the presentembodiment in detail by using TEM, it is found out that the most of thecrystal grain boundaries (over 90%, typically over 95%) is acorresponding grain boundary of Σ3, namely a {211} twin grain boundary.

In a crystal grain boundary formed between two crystal grains, it isknown to make a corresponding grain boundary of Σ3 in case that theplanar orientation of both crystals are {110}, when an angle θ, which isformed by lattice stripes corresponding to a {111} plane, is 70.5°.

In the crystalline silicon film of this embodiment, the lattice stripesare continuous at an angle of about 70.5° in adjacent crystal grains inthe crystal grain boundary. Therefore it is inferred that the crystalgrain boundary is a {211} twin grain boundary.

Note that a corresponding grain boundary of Σ9 is formed when θ=70.5°and these other corresponding grain boundaries also exist.

Such corresponding crystal grain boundary is only formed between crystalgrains of the same planar orientation. In other words, the crystallinesilicon film obtained by implementing the present embodiment can formsuch corresponding grain boundary in a large area because the planarorientation is almost aligned to {110}.

The crystal structure as such (the structure of the crystal grainboundary, to be strict) indicates that different two crystal grains areconnected in a very well aligned manner in the crystal gain boundary.That is, the crystal lattices are continuously connected in the crystalgrain boundary; so that a trap level caused by crystal defect or thelike is hardly formed. Therefore a semiconductor thin film having such acrystal structure may be considered that it has practically no crystalgrain boundary.

The TEM observation further verifies that most of the defects that havebeen present in crystal grains are eliminated by a heat treatment stepat a high temperature of 700 to 1150° C. (corresponding to a thermaloxidation process or a gettering process in the present embodiment).This is also apparent from the fact that the defects are greatlydecreased in number after the heat treatment step compared with thedefects before the step.

This difference in the number of defects reveals as the difference inspin density in Electron Spin Resonance (ESR) analysis. Under thepresent circumstances, it has been found that the crystalline siliconfilm of this embodiment has a spin density of at no more than 5×10¹⁷spins/cm³ (preferably 3×10¹⁷ spins/cm³ or less). However, this measuredvalue is near the detection limit of existing measurement devices, andhence the actual spin density of the film is expectedly even lower.

[Information Regarding Electric Characteristic of a TFT]

A TFT using an active layer of the present invention showed an electriccharacteristic which stands to that of MOSFET. Data shown below wereobtained from a TFT which the Applicant fabricated on experimentalbasis. (Note that the film thickness of the active layer is 30 nm, andthe thickness of the gate insulating film is 100 nm.)

(1) The sub-threshold constant which may be an index of the switchingperformance (switching speed of ON/OFF operation) is as small as 60 to100 mV/decade (typically 60 to 85 mV/decade) both in an n-channel TFTand a p-channel TFT.

(2) The electric field effect mobility (μ_(FE)) which may be an index ofTFT operation speed is as large as 200 to 650 cm²/Vs (typically 300 to500 cm²/Vs) in an n-channel TFT and 100 to 300 cm²/Vs (typically 150 to200 cm²/Vs) in a p-channel TFT.

(3) The threshold voltage (V_(th)) which may be an index of TFT drivingvoltage is as small as between −0.5 and 1.5 V for an n-channel TFT andbetween −1.5 to 0.5 V for a p-channel TFT.

As described above, it is confirmed that an extremely superior switchingperformance and high speed operation characteristic is attainable. Notethat it is possible to freely combine the consititutions of the presentembodiment with constitutions of Embodiments 1 and 2. However it isimportant to utilize catalyst element which promotes crystallization incrystallizing the amorphous semiconductor film as shown in Embodiment 1or 2.

Embodiment 4

The present invention can also be applied to the case in which aninterlayer insulating film is formed on a conventional MOSFET and a TFTis formed thereon. That is, it is also possible to realize athree-dimensionally structured semiconductor device. Further, it ispossible to use an SOI substrate such as a SIMOX, Smart-Cut (registeredtrademark by SOITEC INC.), ELTRAN (registered trademark by CANON INC.),etc.

It is possible to freely combine the constitutions of the presentembodiment with the constitutions of Embodiment 1 or 2.

Embodiment 5

It is possible to apply the present invention to an active matrix ELdisplay.

FIG. 16 is a circuit diagram of the active matrix EL display device.Reference numeral 81 denotes a display section; and X-direction drivercircuit 82 and Y-direction driver circuit 83 are provided in itsperipheral. Each pixel of the display section 81 comprises a switchingTFT 84, a storage capacitor 85, a current control TFT 86, an organic ELelement 87. X-direction signal line 88 a (or 88 b) and a Y-directionsignal line 89 a (or 89 b or 89 c) are connected to the switching TFT84. Power supply lines 90 a and 90 b are connected to the currentcontrol TFT 86.

In the active matrix EL display device of the present embodiment, TFTsthat comprise X direction driver circuit 82 and Y direction drivercircuit 83 are formed by combining a p-channel TFT 1101 and an n-channelTFTs 1102 or 1103 of FIG. 11B. The switching TFT 84 and the currentcontrol TFT 86 are formed from an n-channel TFT 1104 of FIG. 11B.

Note that the constitutions of Embodiment 1 or 2 may be combined to theactive matrix EL display of the present Embodiment.

Embodiment 6

It is possible to use a variety of liquid crystal materials in a liquidcrystal display device manufactured in accordance with the Embodiment 1.For example, the liquid crystal materials disclosed in: Furue, H, etal., “Characteristics and Driving Scheme of Polymer-stabilizedMonostable FLCD Exhibiting Fast Response Time and High Contrast Ratiowith Gray-scale Capability,” SID, 1998; in Yoshida, T., et al., “AFull-color Thresholdless Antiferroelectric LCD Exhibiting Wide ViewingAngle with Fast Response Time,” SID 97 Digest, 841, 1997; S. Inui etal., “Thresholdless antiferroelectricity in Liquid Crystals and itsApplication to Displays”, 671-673, J. Mater. Chem. 6(4), 1996; and inU.S. Pat. No. 5,594,569 can be used.

A liquid crystal that shows antiferroelectric phase in a certaintemperature range is called an antiferroelectric liquid crystal. Among amixed liquid crystal comprising antiferroelectric liquid crystalmaterial, there is one called thresholdless antiferroelectric mixedliquid crystal that shows electrooptical response characteristic inwhich transmittivity is continuously varied against electric field.Among the thresholdless antiferroelectric liquid crystals, there aresome that show V-shaped electrooptical response characteristic, and evenliquid crystals whose driving voltage is approximately ±2.5 V (cellthickness approximately 1 μm to 2 μm) are found.

An example of light transmittivity characteristic against the appliedvoltage of thresholdless antiferroelectric mixed liquid crystal showingV-shaped electro-optical response characteristic, is shown in FIG. 17.The axis of ordinate in the graph shown in FIG. 17 is transmittivity(arbitrary unit) and the axis of the abscissas is the applied voltage.The transmitting direction of the polarizer on light incident side ofthe liquid crystal display is set at approximately parallel to directionof a normal line of the smectic layer of thresholdless antiferroelectricliquid crystal that approximately coincides with the rubbing directionof the liquid crystal display device. Further, the transmittingdirection of the polarizer on the light radiant side is set atapproximately right angles (crossed Nicols) against the transmittingdirection of the polarizer on the light incident side.

As shown in FIG. 17, it is shown that low voltage driving and gray scaledisplay is available by using such thresholdless antiferroelectric mixedliquid crystal.

It becomes possible to reduce the power supply voltage of the samplingcircuit for the image signal to for example approximately 5 to 8 V incase of using such low voltage driving thresholdless antiferroelectricmixed liquid crystal to a liquid crystal display device having an analogdriver. Accordingly the operation power supply voltage for the drivercan be reduced and low consumption electricity and high reliability ofthe liquid crystal display device can be attained.

Further, also in case of using the low voltage driving thresholdlessantiferroelectric mixed liquid crystal to a liquid crystal displaydevice having a digital driver, the operation power supply voltage ofthe D/A converter circuit can be lowered because the output voltage ofthe D/A converter circuit can be lowered, and the operation powervoltage of the driver can be lowered. Accordingly, low consumptionelectricity and high reliability of the liquid crystal display devicecan be attained.

Therefore the use of such low voltage driving thresholdlessantiferrelectric mixed liquid crystal is effective in case of using aTFT having a relatively small LDD region (low concentration impurityregion) width (for instance 0 to 500 nm, or 0 to 200 nm).

Further, thresholdless antiferroelectric mixed liquid crystal has largespontaneous polarization in general, and the dielectric constant of theliquid crystal itself is large. Therefore, comparatively large storagecapacitor is required in the pixel in case of using thresholdlessantiferroelectric mixed liquid crystal for a liquid crystal displaydevice. It is therefore preferable to use thresholdlessantiferroelectric mixed lipid crystal having small spontaneous polarity.It is also acceptable to compensate a small storage capacitor bylengthening a writing period of gray scale voltage to the pixel (pixelfield period) by applying line sequential driving method as the drivingmethod of the liquid crystal display device.

A low consumption electricity of a liquid crystal display is attainedbecause low voltage driving is realized by the use of such thresholdlessantiferroelectric mixed liquid crystal.

Further, any of liquid crystal display can be used as a display mediumof the liquid crystal display device of the present invention oncondition that the liquid crystal has an electro-optical characteristicshown in FIG. 17.

Note that it is possible to combine the constitutions of Embodiment 1 or2 with the constitutions of the present embodiment.

Embodiment 7

CMOS circuits and pixel matrix circuits fabricated by implementing thepresent invention can be utilized for various electro-optical devices(active matrix liquid crystal display, active matrix EL display andactive matrix EL display). Namely, the present invention can beimplemented onto all of the electronic devices that incorporate suchelectro-optical devices as a display section.

Following can be given as such electronic devices: video cameras;digital cameras; projectors (rear type or front type); head mounteddisplays (goggle type displays); car navigation systems; personalcomputers; portable information terminals (mobile computers, portabletelephones or electronic books etc.) etc. Examples of these are shown inFIGS. 18A to 20C.

FIG. 18A is a personal computer which comprises: a main body 2001; animage input section 2002; a display section 2003; and a key board 2004.The present invention can be applied to the image input section 2002,the display section 2003 and other driver circuits.

FIG. 18B is a video camera which comprises: a main body 2101; a displaysection 2102; a voice input section 2103; operation switches 2104; abattery 2105 and an image receiving section 2106. The present inventioncan be applied to the display section 2102, the voice input section 2103and other driver circuits.

FIG. 18C is a mobile computer which comprises: a main body 2201; acamera section 2202; an image receiving section 2203; operation switches2204 and a display section 2205. The present invention can be applied tothe display section 2205 and other signal driver circuits.

FIG. 18D is a goggle type display which comprises: a main body 2301; adisplay section 2302; and an arm section 2303. The present invention canbe applied to the display section 2302 and other driver circuits.

FIG. 18E is a player using a recording medium which records a program(hereinafter referred to as a recording medium) which comprises: a mainbody 2401; a display section 2402; a speaker section 2403; a recordingmedium 2404; and operation switches 2405. This device uses DVD (digitalversatile disc), CD, etc. for the recording medium, and can performmusic appreciation, film appreciation, games and the use for Internet.The present invention can be applied to the display section 2402 andother driver circuits.

FIG. 18F is a digital camera which comprises: a main body 2501; adisplay section 2502; a view finder 2503; operation switches 2504; andan image receiving section (not shown in the figure). The presentinvention can be applied to the display section 2502 and other drivercircuits.

FIG. 19A is a front type projector which comprises: a projection system2601; and a screen 2602. The present invention can be applied to theliquid crystal display device 2808 which forms a part of the projectionsystem 2601 and other signal control circuits.

FIG. 19B is a rear type projector which comprises: a main body 2701; aprojection system 2702; a mirror 2703; and a screen 2704. The presentinvention can be applied to the liquid crystal display device whichforms a part of the projection system 2702 and other signal controlcircuits.

FIG. 19C is a diagram which shows an example of the structure of aprojection system 2601 and 2702 in FIGS. 19A and 1913. Projectionsystems 2601 and 2702 comprise: an optical light source system 2801;mirrors 2802 and 2804 to 2806; a dichroic mirror 2803; a prism 2807; aliquid crystal display device 2808; a phase differentiating plate 2809;and a projection optical system 2810. The projection optical system 2810comprises an optical system having a projection lens. Though the presentembodiment shows an example of 3-plate type, this is not to limit tothis example and a single plate type may be used for instance. Further,an operator may appropriately dispose an optical lens, a film which hasa function to polarize light, a film which adjusts a phase difference oran IR film, etc in the optical path shown by an arrow in FIG. 19C.

FIG. 19D is a diagram showing an example of a structure of an opticallight source system 2801 in FIG. 19C. In the present embodiment theoptical light source system 2801 comprises: a reflector 2811; a lightsource 2812; lens arrays 2813 and 2814; a polarizer conversion element2815; and a collimator 2816. Note that the optical light source systemshown in FIG. 19D is merely an example and the structure is not limitedto this example. For instance, an operator may appropriately dispose anoptical lens, a film which has a function to polarize light, a filmwhich adjusts a phase difference or an IR film, etc.

Note that the projectors shown FIGS. 19A and 19C are the cases of usinga transmissive type electro-optical devices, and applicable examples ofa reflection type electro-optical device and an EL, display device arenot shown.

FIG. 20A is a portable telephone which comprises: a main body 2901; avoice output section 2902; a voice input section 2903; a display section2904; operation switches 2905; and an antenna 2906 etc. The presentinvention can be applied to the voice output section 2902, the voiceinput section 2903, the display section 2904 and other driver circuits.

FIG. 20B is a portable book (electronic book) which comprises: a mainbody 3001; display sections 3002 and 3003; a recording medium 3004;operation switches 3005 and an antenna 3006 etc. The present inventioncan be applied to the display sections 3002 and 3003, and other drivercircuits.

FIG. 20C is a display which comprises: a main body 3101; a supportingsection 3102; and a display section 3103 etc. The present invention canbe applied to the display section 3103. The display of the presentinvention is advantageous specifically when large sized, and it isadvantageous in a display having a diagonal exceeding 10 inches(specifically 30 inches).

As described above, the applicable range of the present invention isvery large, and the invention can be applied to electronic devices ofvarious areas. Note that the electronic devices of the presentembodiment can be achieved by utilizing any combination of constitutionsin Embodiments 1 to 6.

Embodiment 8

An example of manufacturing an EL (electro-luminescence) display deviceby using the present invention is described in the present Embodiment.Note that FIG. 23A is a top view of an EL display device of the presentinvention and FIG. 23B shows its cross sectional structure.

In FIG. 23A: reference numeral 4001 denotes a substrate; 4002, a pixelsection; 4003, a source driver circuit; 4004, a gate driver circuit.Each driver circuit reaches FPC (flexible print circuit) 4006 throughwiring 4005, and then connected to external machines.

Here, a first sealing material 4101, a cover material 4102, a fillingmaterial 4103 and second sealing material 4104 are disposed to surrounda pixel section 4002, a source driver circuit 4003 and a gate drivercircuit 4004.

Further, FIG. 238 corresponds to a cross-sectional diagram at A-A′ ofFIG. 23A. A driver TFT 4201 which comprises a source driver circuit 4003(note that an n-channel TFT and a p-channel TFT are shown in the figure)and a current control TFT (a TFT which controls electric current thatflows into an EL element) 4202 which comprises the pixel section 4002are formed over a substrate 4001.

In the present embodiment a TFT having the same structure as a p-channelTFT or an n-channel TFT in FIG. 12 is used for a driver TFT 4201 and aTFT having the same structure as a p-channel TFT in FIG. 12 is used fora current control TFT 4202. Further, a storage capacitor (not shown)which is connected to the gate of a current control TFT 4202 is disposedin the pixel section 4002.

An interlayer insulating film (flattening film) 4301 comprising a resinmaterial is formed over a driver TFT 4201 and a pixel TFT 4202, and apixel electrode (anode) 4302 that is electrically connected to the drainof a pixel TFT 4202 is formed thereon. As a pixel electrode 4302, atransparent conductive film which has a large work function is used. Acompound of indium oxide and tin oxide, a compound of indium oxide andzinc oxide, zinc oxide, tin oxide or indium oxide can be used as thetransparent conductive film. In addition, a material added with galliumto the above stated transparent conductive film may also be used.

An insulating film 4303 is formed on the pixel electrode 4302 and anopening section is formed in the insulating film 4303 at above the pixelelectrode 4302. In this opening section an EL (electro-luminescence)layer 4304 is formed over the pixel electrode 4302. A known organic orinorganic EL material can be used for the EL layer 4304. Further thoughthere are small molecular materials and polymer materials in the organicEL materials, either may be used.

A known evaporation technique or a coating technique may be used for theformation method of the EL layer 4304. Further, the structure of ELlayer may be a laminate structure or a single layer structure by freelycombining a hole injection layer, a hole transport layer, a lightemitting layer, an electron transport layer or an electron injectionlayer.

A cathode 4305 comprising a conductive film containing an element whichbelongs to group 1 or 2 of the periodic table (typically a conductivefilm in which alkali metal element or alkali earth metal element isincluded in aluminum, copper or silver) is formed over EL layer 4304. Itis preferable to avoid as much as possible of moisture and oxygen thatexist in the interface between the cathode 4305 and the EL layer 4304.Accordingly measures such as successive deposition of the two in avacuum, or forming EL layer 4304 in a nitrogen or noble gas atmosphereand then forming cathode 4305 without contact to oxygen and moisture,are required. In the present embodiment the deposition described aboveis made possible by using a deposition apparatus such as a multi-chambersystem (cluster-tool system).

The cathode 4305 is electrically connected to the wiring 4005 in aregion denoted by reference numeral 4306. Wiring 4005 is a wiring forapplying preset voltage to the cathode 4305 and is electricallyconnected to FPC 4006 through an isotropic conductive film 4307.

Thus an EL element which comprises a pixel electrode (anode) 4302, an ELlayer 4304 and a cathode 4305 is formed. The EL elements are surroundedby first sealing material 4101 and a cover member 4102 which is stuck toa substrate 4001 by the first sealing material 4101 and sealed byfilling material 4103.

As the cover member 4102, a glass material, a metallic material(typically stainless steel), a ceramics material and a plastic material(including a plastic film) can be used. As a plastic material, FRP(fiberglass-reinforced plastics) plate, PVF (polyvinyl fluoride) film,Myler film, polyester film or acrylic resin film can be used. Further, asheet having a structure in which aluminum foil is sandwiched by PVFfilm or Myler film can be used.

Note however, the cover member needs to be transparent in case thatradiation from EL elements are directed to the direction toward covermember. In such cases, a transparent substance such as a glass plate, aplastic plate, a polyester film or an acrylic film is used.

A ultraviolet ray curing resin or a thermosetting resin can be used asfilling material 4103, and PVC (polyvinyl chloride), acrylic, polyimide,epoxy resin, silicone resin, PVB (polyvinyl butyral), or EVA (ethylenevinyl acetate) can be used. If a drying agent (preferably barium oxide)is formed on the inside of the filling material 4103, deterioration ofEL elements can be prevented.

Further, spacers may be included within the filling material 4103. Whenthe spacers are formed from barium oxide, it is possible to give theability to absorb moisture to the spacers themselves. In addition, it iseffective to provide a resin film over cathode 4305, as a buffer layerthat releases pressure from the spacers in case of disposing thespacers.

The wiring 4005 is electrically connected to the FPC 4006 throughanisotropic conductive film 4307. Wiring 4005 transmits signals that aresent to pixel section 4002, source driver circuit 4003 and gate drivercircuit 4004 to FPC 4006, and is electrically connected to an externaldevice by FPC 4006.

In the present embodiment a structure that thoroughly shields the ELelements from external atmosphere is employed in which second sealingmaterial 4104 is provided so as to cover the exposed portions of firstsealing material 4101 and a part of FPC 4006. An EL display devicehaving the cross sectional structure of FIG. 23B is thus complete.

A more detailed structure on a cross section of pixel section is shownin FIG. 24, a top view is shown in FIG. 25A, and circuit diagram isshown in FIG. 25B. Common reference numerals are used in FIGS. 24, 25Aand 25B, so that the figures may be compared with each other.

In FIG. 24, switching TFT 4402 disposed over substrate 4401 is formedfrom an n-channel TFT 1104 of FIG. 12. Accordingly, the description ofn-channel TFT 1104 of FIG. 12 may be referred regarding the structure.The wiring shown by 4403 is a gate wiring that electrically connectsgate electrodes 4404 a and 4404 b of switching TFT 4402.

Note that while the present invention uses a double gate structure inwhich 2 channel forming regions are formed, single gate structure inwhich one channel forming region is formed or a triple gate structure inwhich 3 channel forming regions are formed are also acceptable.

The drain wiring 4405 of switching TFT 4402 is electrically connected togate electrode 4407 of current control TFT 4406. Note that currentcontrol TFT 4406 is formed from a p-channel TFT 1101 of FIG. 12.Accordingly, the description of the p-channel TFT 1101 of FIG. 12 may bereferred regarding the description of the structure. Note that while thepresent embodiment uses a single gate structure, a double gate structureor a triple gate structure are also acceptable.

A first passivation film 4408 is disposed over the switching TFT 4402and the current control TFT 4406, and a planarization film 4409comprising resin is formed on top. It is very important to flatten byusing the planarization film 4409, the step due to the TFTs. Since an ELlayer formed later is extremely thin, there are cases in which defectiveluminescence is caused due to the existence of the step. Therefore, itis preferable to planarize before forming pixel electrode so as to forman EL layer on a planarized surface as possible.

The reference numeral 4410 denotes a pixel electrode (anode of ELelement) comprising a transparent conductive film, and is electricallyconnected to the drain wiring 4417 of current control TFT 4406. Acompound of indium oxide and tin oxide, a compound of indium oxide andzinc oxide, zinc oxide, tin oxide or indium oxide can be used as thetransparent conductive film. Further, said conductive transparentincluding gallium may also be used.

An EL layer 4411 is formed on pixel electrode 4410. Note that while FIG.24 shows only 1 pixel, EL layers corresponding to each colors of R(red), G (green) and B (blue) are each formed properly in the presentembodiment. A small molecular type organic EL material is formed byevaporation in the present embodiment. In concrete, a laminate structureis formed from a copper phthalocyanine (CuPc) film of 20 nm thicknessdisposed as a hole injection layer, and tris-8-quinolinolate aluminumcomplex (Alq₃) film formed thereon into 70 nm thickness as a luminescentlayer. A luminescent color may be controlled by adding fluorescent dyesuch as quinacridon, Perylene or DCM1 into Alq₃.

However, the above example is one example of the organic EL materialsthat can be used as luminescence layers, and it is not necessary tolimit to these materials. An EL layer (a layer for luminescence and forperforming carrier motion for luminescence) may be formed by freelycombining luminescence layer, charge transport layer, or chargeinjection layer. For example, an example using small molecular typematerials as luminescence layers is shown in the present embodiment, butpolymer type organic EL materials may also be used. Further, it ispossible to use inorganic materials such as silicon carbide, etc., ascharge transport layer and charge injection layer. Publicly knownmaterials can be used for these organic EL materials and inorganicmaterials.

A cathode 4412 comprising a conductive film is next formed on EL layer4411. In the case of the present embodiment, an alloy film of aluminumand lithium is used as the conductive film. Needless to say, a publiclyknown MgAg film (alloy film of magnesium and silver) may also be used.As the cathode material, a conductive film comprising an elementbelonging to periodic table group 1 or 2, or a conductive film addedwith at least one of these elements, may be used.

EL element 4413 is completed at the point when this cathode 4412 isformed. Note that an EL element 4413 formed here represents a capacitorformed from pixel electrode (anode) 4410, EL layer 4411 and cathode4412.

The top view of the pixel in the present embodiment is next described byusing FIG. 25A. Source region of switching TFT 4402 is connected tosource wiring 4415 and drain region is connected to drain wiring 4405.Further, drain wiring 4405 is electrically connected to gate electrode4407 of current control TFT 4406. Source region of current control TFT4406 is electrically connected to current supply line 4416 and drainregion is electrically connected to drain wiring 4417. Drain wiring 4417is electrically connected to pixel electrode (anode) 4418 shown bydotted line.

Here, a storage capacitor is formed in the region shown by 4419. Storagecapacitor 4419 is formed from a semiconductor film 4420 electricallyconnected to current supply line 4416, an insulating film formed of thesame layer as gate insulating film (not shown) and gate electrode 4407.Further, it is possible to use a capacitance formed from gate electrode4407, a layer formed from the same layer as the first interlayerinsulating film (not shown) and current supply line 4416, for a storagecapacitor.

Embodiment 9

In embodiment 9 an EL display device having a pixel structure differingfrom embodiment 8 is described. FIG. 26 is used for explanation. Notethat the description of embodiment 8 may be referred regarding partswhere the same reference numerals as FIG. 25 are given.

In FIG. 26 a TFT having the same structure as n-channel TFT 1102 of FIG.12 is used as current control TFT 4501. Needless to say, gate electrode4502 of current control TFT 4501 is electrically connected to drainwiring 4405 of switching TFT 4402. Drain wiring 4503 of current controlTFT 4501 is electrically connected to pixel electrode 4504.

In embodiment 9, a pixel electrode 4504 comprising a conductive filmfunctions as a cathode of the EL element. An alloy film of aluminum andlithium is used in concrete, but a conductive film comprising an elementbelonging to periodic table group 1 or 2, or a conductive film addedwith such element may be used here.

EL layer 4505 is formed on top of pixel electrode 4504. Note that thoughFIG. 26 shows only 1 pixel, EL layer corresponding to G (green) isformed in the present embodiment by evaporation method or coating method(preferably spin coating). In concrete, it is a laminate structurecomprising a lithium fluoride (LiF) film of 20 nm thickness provided aselectron injection layer and a PPV (poly-p-phenylene vinylene) of 70 mmthickness provided thereon as luminescence layer.

An anode 4506 comprising transparent conductive film is next disposed onEL layer 4505. In the present embodiment, a compound of indium oxide andtin oxide or a compound of indium oxide and zinc oxide is used as thetransparent conductive film.

On completing formation of anode 4506, an EL element 4507 is finished.Note that EL element 4507 represents here a capacitor formed from pixelelectrode (cathode) 4504, EL layer 4505 and anode 4506.

Degradation due to hot carrier effect is actualized in a current controlTFT 4501 in case that the voltage applied to the EL element is such ahigh voltage as exceeding 10V. It is effective to use an n-channel TFThaving a structure of the present invention as the current control TFT4501.

Note that, the current control TFT 4501 of the present embodiment formsa parasitic capacitance, which is referred to as gate capacitance, inbetween gate electrode 4502 and LDD regions 4509. It is possible toprovide the same function as storage capacitor 4419 shown in FIGS. 25Aand 25B by adjusting this gate capacitance. Specifically in case ofdriving the EL display device by digital driving method, it is possibleto use the gate capacitance for storage capacitor because thecapacitance of storage capacitor can be smaller compared to the case ofdriving by analog driving method.

Note that an n-channel TFT having a structure in which LDD region 4509is omitted from the structure shown in FIG. 26 may be used in case thevoltage applied to an EL element is less than 10V preferably less than5V because above stated degradation due to hot carrier effect would notbecome a serious problem.

Embodiment 10

In this embodiment, examples of a pixel structure which can be used fora pixel portion of an EL display device shown in the embodiment 8 or 9will be shown in FIGS. 27A to 27C. Note that in this embodiment,reference numeral 4601 designates a source wiring line of a switchingTFT 4602; 4603, a gate wiring line of the switching TFT 4602; 4604, acurrent controlling TFT; 4605, a capacitor; 4606 and 4608, currentsupply lines; and 4607, an EL component.

FIG. 27A shows an example of a case in which the current supply line4606 is made common to two pixels. That is, this example ischaracterized in that two pixels are formed to become linearlysymmetrical with respect to the current supply line 4606. In this case,since the number of current supply lines can be reduced, the pixelportion can be made further minute.

FIG. 27B shows an example of a case in which the current supply line4608 is provided in parallel with the gate wiring line 4603. In FIG.27B, although such a structure is adopted that the current supply line4608 and the gate wiring line 4603 do not overlap with each other, ifboth are wiring lines formed in different layers, it is also possible toprovide the lines so that both are overlapped with each other through aninsulating film. In this case, since an occupied area can be made commonto the current supply line 4608 and the gate wiring line 4603, the pixelportion can be made further minute.

FIG. 27C shows an example characterized in that similarly to thestructure of FIG. 27B, the current supply line 4608 is provided to be inparallel with gate wiring lines 4603 a and 4603 b, and further, twopixels are formed to become linearly symmetrical with respect to thecurrent supply line 4608. It is also effective to provide the currentsupply line 4608 so that it overlaps with either one of the gate wiringlines 4603 a and 4603 b. In this case, since the number of currentsupply lines can be decreased, the pixel portion can be made furtherminute.

Embodiment 11

In this embodiment, examples of a pixel structure of an EL displaydevice in which the invention is carried out will be shown in FIGS. 28Aand 28B. In this embodiment, reference numeral 4701 designates a sourcewiring line of a switching TFT 4702; 4703, a gate wiring line of theswitching TFT 4702; 4704, a current controlling TFT; 4705, a capacitor(can be omitted); 4706, a current supply line; 4707, a power sourcecontrolling TFT; 4708, an EL component; and 4709, a power sourcecontrolling gate wiring line. The operation of the power sourcecontrolling TFT 4707 may be referred to Japanese Patent Application No.Hei. 11-341272 (not published).

In this embodiment, although the power source controlling TFT 4707 isprovided between the current controlling TFT 4704 and the EL component4708, such a structure may be adopted that the current controlling TFT4704 is provided between the power source controlling TFT 4707 and theEL component 4708. It is preferable that the power source controllingTFT 4707 is made to have the same structure as the current controllingTFT 4704 or is formed of the same active layer as the currentcontrolling TFT and is connected in series therewith.

FIG. 28A shows an example of a case in which the current supply line4706 is made common to two pixels. That is, this example ischaracterized in that two pixels are formed to become linearlysymmetrical with respect to the current supply line 4706. In this case,since the number of current supply lines can be reduced, the pixelportion can be made further minute.

FIG. 28B shows an example of a case in which a current supply line 4710is provided in parallel with the gate wiring line 4703, and a powersource controlling gate wiring line 4711 is provided in parallel withthe source wiring line 4701. Note that in FIG. 28B, although such astructure is adopted that the current supply line 4710 and the gatewiring line 4703 do not overlap with each other, if both are wiringlines formed in different layers, it is also possible to provide thelines so that both are overlapped with each other through an insulatingfilm. In this case, since an occupied area can be made common to thecurrent supply line 4710 and the gate wiring line 4703, the pixelportion can be made further minute.

Embodiment 12

In this embodiment, examples of a pixel structure of an EL displaydevice in which the invention is carried out will be shown in FIGS. 29Aand 29B. In this embodiment, reference numeral 4801 designates a sourcewiring line of a switching TFT 4802; 4803, a gate wiring line of theswitching TFT 4802; 4804, a current controlling TFT; 4805, a capacitor(can be omitted); 4806, a current supply line; 4807, an erasing TFT;4808, an erasing gate wiring line; and 4809, an EL component. Theoperation of the erasing TFT 4807 may be referred to Japanese PatentApplication No. Hei. 11-338786 (not published).

The drain of the erasing TFT 4807 is connected to the gate of thecurrent controlling TFT 4804, so that a gate voltage of the currentcontrolling TFT 4804 can be forcibly changed. Although the erasing TFT4807 may be made of an n-channel TFT or a p-channel TFT, it ispreferable that the TFT has the same structure as the switching TFT 4802so that an off current can be made small.

FIG. 29A shows an example of a case in which the current supply line4806 is made common to two pixels. That is, this example ischaracterized in that two pixels are formed to become linearlysymmetrical with respect to the current supply line 4806. In this case,since the number of current supply lines can be reduced, the pixelportion can be made further minute.

FIG. 29B shows an example of a case in which a current supply line 4810is provided in parallel with the gate wiring line 4803, and an erasinggate wiring line 4811 is provided in parallel with the source wiringline 4801. In FIG. 29B, although such a structure is adopted that thecurrent supply line 4810 and the gate wiring line 4803 do not overlapwith each other, if both are wiring lines formed in different layers, itis also possible to provide the lines so that both are overlapped witheach other through an insulating film. In this case, since an occupiedarea can be made common to the current supply line 4810 and the gatewiring line 4803, the pixel portion can be made further minute.

Embodiment 13

In the structure of an EL display device in which the invention iscarried out, the number of TFTs provided in a pixel is not limited. Forexample, four to six or more TFTs may be provided. The invention can becarried out without limiting the pixel structure of the EL displaydevice.

As described above, according to the technique of the invention, a heattreatment time required for a crystallization step is shortened and aTFT having excellent electrical characteristics can be fabricated.

Besides, a heat treatment time required for gettering is shortened, anda TFT having excellent electrical characteristics can be fabricated.

Besides, by optimizing the width and arrangement of catalytic elementintroduction regions with the technique of the invention, it is possibleto effectively arrange the catalytic element introduction regions in asmall space and to make a circuit minute and integrated.

1. An electronic device comprising: (a) a main body; (b) an antennaattached to the main body; and (c) a liquid crystal device attached tothe main body, the liquid crystal device comprising: a first thin filmtransistor over a first substrate having an insulating surface, thefirst thin film transistor comprising at least a channel forming region,a source region, and a drain region, a first wiring electricallyconnected to the first thin film transistor; a driver circuit comprisinga second thin film transistor over the first substrate; a leveling filmover the first thin film transistor, the second thin film transistor,and the first wiring, the leveling film having an opening to reach thefirst wiring; a pixel electrode formed over the leveling film andconnected to the first wiring through the opening of the leveling film;an alignment film on the pixel electrode; a first spacer adjacent to thealignment film where the first spacer overlaps the opening of theleveling film at least partly; a second spacer over the driver circuitand the leveling film; a second substrate opposed to the first substratewith the first and second spacers interposed therebetween; and a liquidcrystal between the first and second substrates, wherein the liquidcrystal is disposed over the pixel electrode and the driver circuit. 2.The electronic device according to claim 1 wherein the channel formingregion comprises crystalline silicon.
 3. The electronic device accordingto claim 1 further comprising a second liquid crystal device attached tothe main body.
 4. The electronic device according to claim 1 wherein theelectronic device is an electronic book.
 5. An electronic devicecomprising: (a) a main body; (b) an antenna attached to the main body;and (c) a liquid crystal device attached to the main body, the liquidcrystal device comprising: a first thin film transistor over a firstsubstrate having an insulating surface, the first thin film transistorcomprising at least a channel forming region, a source region, and adrain region, a first wiring electrically connected to the first thinfilm transistor; a driver circuit comprising a second thin filmtransistor over the first substrate; a leveling film over the first thinfilm transistor, the second thin film transistor and the first wiring,the leveling film having an opening to reach the first wiring; a pixelelectrode formed over the leveling film and connected to the firstwiring through the opening of the leveling film; a first spacer over thepixel electrode where the first spacer overlaps the opening of theleveling film at least partly; a second spacer over the driver circuitand the leveling film; a second substrate opposed to the first substratewith the first and second spacers interposed therebetween; and a liquidcrystal between the first and second substrates, wherein the liquidcrystal is disposed over the pixel electrode and the driver circuit. 6.The electronic device according to claim 5 wherein the channel formingregion comprises crystalline silicon.
 7. The electronic device accordingto claim 5 further comprising a second liquid crystal device attached tothe main body.
 8. The electronic device according to claim 5 wherein theelectronic device is an electronic book.
 9. An electronic devicecomprising: (a) a main body; (b) an antenna attached to the main body;and (c) a liquid crystal device attached to the main body, the liquidcrystal device comprising: a first thin film transistor over a firstsubstrate having an insulating surface, the first thin film transistorcomprising: a semiconductor film comprising silicon formed over thefirst substrate; a gate insulating film formed over the semiconductorfilm; and a gate electrode formed over the semiconductor film with thegate insulating film interposed therebetween, a driver circuitcomprising a second thin film transistor over the first substrate; afirst interlayer insulating film formed over the first thin filmtransistor and the second thin film transistor; a wiring formed over thefirst interlayer insulating film and electrically connected to the firstthin film transistor through a first contact hole of the firstinterlayer insulating film; a second interlayer insulating film formedover the driver circuit, the wiring and the first interlayer insulatingfilm; a pixel electrode formed over the second interlayer insulatingfilm wherein the pixel electrode is electrically connected to the wiringthrough a second contact hole of the second interlayer insulating film;a first spacer formed over the pixel electrode; a second spacer formedover the driver circuit and the second interlayer insulating film; asecond substrate opposed to the first substrate; a liquid crystalbetween the first and second substrates; wherein the liquid crystal isdisposed over the pixel electrode and the driver circuit, and whereinthe first spacer overlaps the second contact hole of the secondinterlayer insulating film at least partly.
 10. The electronic deviceaccording to claim 9 wherein the semiconductor film comprisescrystalline silicon.
 11. The electronic device according to claim 9further comprising a second liquid crystal device attached to the mainbody.
 12. The electronic device according to claim 9 wherein theelectronic device is an electronic book.
 13. The electronic deviceaccording to claim 9 wherein the semiconductor film is a crystallinesemiconductor film formed through crystal growth from a plurality ofregions where a catalytic element for promoting crystallization isintroduced, the semiconductor film includes a channel forming region, asource region, and a drain region, and the source region or drain regionincludes a boundary portion of regions formed through crystal growthfrom the plurality of regions.
 14. An electronic device comprising: (a)a main body; (b) an antenna attached to the main body; and (c) a liquidcrystal device attached to the main body, the liquid crystal devicecomprising: a first thin film transistor over a first substrate havingan insulating surface, the first thin film transistor comprising: asemiconductor film comprising silicon formed over the first substrate; agate insulating film formed over the semiconductor film; and a gateelectrode formed over the semiconductor film with the gate insulatingfilm interposed therebetween, a driver circuit comprising a second thinfilm transistor over the first substrate; a first interlayer insulatingfilm formed over the first thin film transistor and the second thin filmtransistor; a wiring formed over the first interlayer insulating filmand electrically connected to the first thin film transistor through afirst contact hole of the first interlayer insulating film; a secondinterlayer insulating film formed over the driver circuit, the wiringand the first interlayer insulating film; a pixel electrode formed overthe second interlayer insulating film wherein the pixel electrode iselectrically connected to the wiring through a second contact hole ofthe second interlayer insulating film; an alignment film formed on thepixel electrode; a first spacer adjacent to the alignment film; a secondspacer formed over the driver circuit and the second interlayerinsulating film; a second substrate opposed to the first substrate; anda liquid crystal between the first and second substrates, wherein theliquid crystal is disposed over the pixel electrode and the drivercircuit, and wherein the first spacer overlaps the second contact holeof the second interlayer insulating film at least partly.
 15. Theelectronic device according to claim 14 wherein the semiconductor filmcomprises crystalline silicon.
 16. The electronic device according toclaim 14 further comprising a second liquid crystal device attached tothe main body.
 17. The electronic device according to claim 14 whereinthe electronic device is an electronic book.
 18. The electronic deviceaccording to claim 14 further comprising a second liquid crystal deviceattached to the main body.